A Power-Driven Thermal Sensor Placement Algorithm for Dynamic Thermal Management

Wang, Hai; Tan, Sheldon X.-D.; Swarup, Sahana; Liu, Xuexin

doi:10.7873/date.2013.252

Cited by 14 publications

(2 citation statements)

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“…Optimal sensor placement has been studied extensively for thermal monitoring of low power density electronics (LPDEs) [26,27], such as microprocessors [28][29][30][31][32], multi-core processors, Network-on Chip (NoC) and System on Chip (SoC) devices [26,27,33,34], data centers [35], and cyber physical systems (CPSs) [36]. LPDEs are electronic devices where the power to volume ratio is small.…”

Section: Motivationmentioning

confidence: 99%

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Optimal Sensor Placement Methods for Active Power Electronic Systems

Peddada

Tannous

Alleyne

et al. 2017

Volume 2A: 43rd Design Automation Conference

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Accurate temperature estimation of high density active power electronic systems is vital for dynamic thermal management. Accurate and reliable estimation is especially important in regions that are close to failure, either due to high temperature or significant materials or component sensitivity. Improved estimation can support lower safety factors and enhanced system performance. An investigation of optimal temperature sensor placement methods is presented here, focusing primarily on methods utilizing information-based metrics. In addition, physics-based metrics are explored in an initial study that may have the potential to be more closely aligned with overall system utility. Studies are based on a 2 kW, single-phase, seven-level, GaN-based inverter. A lumped-parameter reduced-order thermal model, developed in previous work, is used for real-time temperature estimation. A continuous relaxation of a 2D placement domain led to a novel linear programming formulation that supports solution of finely-discretized sensor placement problems with minimal computational expense. Improved sensor placement performance metrics account for multiple loading conditions and estimation accuracy with respect to failure prevention.

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Section: Motivationmentioning

confidence: 99%

“…As a result, thermal consid-erations are not usually a significant design concern. Sensor placement strategies for power electronics have included uniform or non-uniform allocation [30], by grid-based or clustering techniques [28,33,37], distance minimization and greedy approaches [32,38] and entropy-based metrics [34].…”

Section: Motivationmentioning

confidence: 99%