A novel ultra-thin vapor chamber with composite wick for portable electronics cooling

Yan, Caiman; Li, Hongming; Tang, Yong; Ding, Xinrui; Yuan, Xuepeng; Liang, Yifu; Zhang, Shiwei

doi:10.1016/j.applthermaleng.2023.120340

Cited by 35 publications

(5 citation statements)

References 48 publications

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“…Packaging structure. The chip high-conducting heat packaging structure CoVC realizes the rapid heat transfer through the evaporation-condensation phase change of the coolant, and its heat transfer capacity is dozens or even hundreds of times that of traditional packaging materials 26 . Figure 1 shows the heat dissipation diagram of the CoVC chip package designed in this work.…”

Section: Resultsmentioning

confidence: 99%

“…In contrast, the coolants inside the passive cooling packages are solitarily driven by the temperature gradient and the capillary force. The typical passive embedded cooling packages contain the vapor chamber (VC, a passive phase change heat transfer device) [25][26][27] . Associated with the wick structures, the evaporation/condensation circulation in the VC can rapidly remove the heat flux from hotspots and achieve hightemperature uniformity on the hotspot surfaces 28,29 .…”

Section: Introductionmentioning

confidence: 99%

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Co-designing chip package structure on the ceramic vapor chamber for the high-conducting heat packaging

Bai,

Wang,

Zhang

et al. 2024

Preprint

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Conventional chip packaging generates a huge thermal resistance due to the low thermal conductivity of the packaging materials that separate chip dies and coolant. Some chip package structures with liquid cooling are developed, but at the same time, these will bring additional risks to running safety. Here we propose and fabricate a completely closed high-conducting heat chip package based on the passive phase change and the compatible material with the chip dies: chip on vapor chamber (CoVC), to realize the rapid diffusion of the heat of hot spots, so as to completely eliminate the energy consumption of the refrigeration which usually takes up the largest share in the power of the heat management. Multi-scale wicks and bionic vein structures are applied to CoVC. The multi-scale wick could increase the turning heat load of the CoVC from 20 W to 140 W, which was a 600% increase. The combination of bionic vein structure and CoVC has an increase of 164% in the heat transfer performance. The thermal resistance of the package was only a third of that traditional package. This means that the structure of CoVC has a good ability in thermal conducting and can reduce energy consumption for heat dissipation.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Co-designing chip package structure on the ceramic vapor chamber for the high-conducting heat packaging

Bai,

Wang,

Zhang

et al. 2024

Preprint

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“…Vapor chambers, as a promising thermal management device with high heat dissipation efficiency, a controllable shape, and good temperature uniformity, have garnered significant attention in various applications, including aerospace, electronic components, and home appliances [1][2][3][4]. They consist of a container, capillary wick, and working fluid [5].…”

Section: Introductionmentioning

confidence: 99%

Effect of Copper Content on the Microstructure and Properties of the Sintered Porous Aluminum Wick

Cai,

Duan

2024

Metals

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Porous aluminum has been widely used as a wick, an electrode, and in other products, due to its advantages of a light weight, pore uniformity, and corrosion resistance. However, the dense alumina layer on the surface of Al powder hinders its densification during sintering. In this paper, porous aluminum was prepared via loose powder sintering with the addition of Cu as a sintering aid. The effects of Cu content on the microstructure and wick properties of the porous aluminum were investigated. The results showed that, with increasing Cu content, the porosity and capillary properties of porous Al decreased, while the compressive strength improved. The optimal Cu content was determined to be 3 wt.% and the prepared porous Al has a porosity of 47.5%, plateau stress of 11.82 MPa, and capillary characteristic parameter of 6.72 × 10−8 N, meeting the requirements for wicks in heat pipes. These findings contribute to the demand for the lightweight design of heat pipes for aerospace applications.

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“…The capillary wick, which provides the driving force to facilitate liquid flow from the condenser to the evaporator and further maintain vapor–liquid phase-change circulation, is one of the vital components of the vapor chamber. The traditional metal mesh wick, , sintered wick, , and composite wick are not insulators and cannot satisfy the insulation requirements of high-voltage electronic components . Although the sintered porous ceramic wick and glass wick are insulators, their extremely low thermal conductivity, high cost for sintering the wicks onto the shell plate, and the presence of contact thermal resistance at the interface of the wick and the shell plate limit their widespread use for ceramic vapor chambers.…”

Section: Introductionmentioning

confidence: 99%

High-Performance Bioinspired Hierarchical Microgroove Wick for Ceramic Vapor Chambers Achieved by Nanosecond Pulsed Lasers

Yuan,

Yan,

Huang

et al. 2024

Langmuir

Self Cite

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Directly integrating ceramic vapor chambers into the insulating substrate of semiconductor power devices is an effective approach to solve the problem of heat dissipation. Microgrooves that could be machined directly on the shell plate without contact thermal resistance and mechanical dislocation offer exciting opportunities to achieve high-performance ceramic vapor chambers. In this study, a bioinspired hierarchical microgroove wick (BHMW) containing low ribs via one-step nanosecond pulsed laser processing was developed, as inspired by the Sarracenia trichome. The superwicking behavior of microgrooves with different structural parameters was investigated using capillary rise tests and droplet-spreading experiments. The BHMW exhibited excellent capillary performance and anisotropic hemiwicking performance. At a laser scanning spacing of 30 μm, the BHMW achieved a capillary wicking height of 114 mm within 20 s. The optimized BHMW demonstrated a capillary parameter (ΔP c •K) and an anisotropic hemiwicking ratio of 4.46 × 10 −7 N and 11.93, respectively, which were 1182 and 946% higher than references, as achieved through nanosecond pulsed laser texturing under identical parameters. This work not only develops a high-performance hierarchical alumina microgroove wick structure but also outlines design guidelines for high-performance ceramic vapor chambers for thermal management in semiconductor power devices.

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A novel ultra-thin vapor chamber with composite wick for portable electronics cooling

Cited by 35 publications

References 48 publications

Co-designing chip package structure on the ceramic vapor chamber for the high-conducting heat packaging

Co-designing chip package structure on the ceramic vapor chamber for the high-conducting heat packaging

Effect of Copper Content on the Microstructure and Properties of the Sintered Porous Aluminum Wick

High-Performance Bioinspired Hierarchical Microgroove Wick for Ceramic Vapor Chambers Achieved by Nanosecond Pulsed Lasers

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