A novel sizing environment (DSP-1) dealing with semi-numerical models applied to the optimization of a bi-stable out-of-plane magnetic micro-switch

Chetouani, Hichem; Rostaing, Hervé; Würtz, Fréderic; Reyne, Gilbert; Delinchant, Benoît

doi:10.1109/tmag.2006.871968

Cited by 2 publications

(1 citation statement)

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“…Vertical actuators with large stroke have been shown to play an important role in optical and electrical applications [1,2]. Various transduction mechanisms have been proposed to realize vertical actuation, among which, electrostatic [1] and magnetic actuators [3] most of which rely on vertically displaced electrodes (comb fingers) or magnetic poles. The electrodes/magnetic poles should be microfabricated in such a way that they are initially vertically misaligned, and as actuation occurs, they are snapped into alignment at the same vertical height level.…”

Section: Introductionmentioning

confidence: 99%

A single mask process for the realization of fully-isolated, dual-height MEMS metallic structures separated by narrow gaps

Kim

Allen

2018

J. Micromech. Microeng.

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Multi-height metallic structures are of importance for various MEMS applications, including master molds for creating 3D structures by nanoimprint lithography, or realizing vertically displaced electrodes for out-of-plane electrostatic actuators. Normally these types of multi-height structures require a multi-mask process with increased fabrication complexity. In this work, a fabrication technology is presented in which fully-isolated, dual-height MEMS metallic structures separated by narrow gaps can be realized using a self-aligned, single-mask process. The main scheme of this proposed process is through-mold electrodeposition, where two photoresist mold fabrication steps and two electrodeposition steps are sequentially implemented to define the thinner and thicker structures in the dual-height configuration. The process relies on two selfaligned steps enabled by the electrodeposited thinner structures: a wet-etching of the seed layer utilizing the thinner structure as an etch-mask to electrically isolate the thinner and the thicker structures, and a backside UV lithography utilizing the thinner structure as a lithographic mask to create a high-aspect-ratio mold for the thicker structure through-mold electrodeposition. The latter step requires the metallic structures to be fabricated on a transparent substrate. Test structures with differences in aspect ratio are demonstrated to showcase the capability of the process.

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