Abstract:A new metal patterning process using photocatalyst was developed to reduce the number of chemical processing steps and to obtain high resolution. Films of amorphous TiO 2 and water-soluble polyvinyl alcohol were used as photocatalytic layers. UV light was illuminated through a photomask onto the photocatalytic layers. Pd(II) in an aqueous solution was reduced to Pd(0) by the exposed TiO 2 and deposited on the exposed regions. Selective electroless Ni/Cu plating on the Pd patterns showed high resolution metal p… Show more
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