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2016
DOI: 10.1088/0022-3727/49/50/505102
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A novel nondestructive testing method for amorphous Si–Sn–O films

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Cited by 20 publications
(24 citation statements)
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“…Compared with indium gallium zinc oxide thin film, a‐STO has the advantages of controllable composition, no toxicity, low raw material cost, etc. so a‐STO has a broad application prospect …”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…Compared with indium gallium zinc oxide thin film, a‐STO has the advantages of controllable composition, no toxicity, low raw material cost, etc. so a‐STO has a broad application prospect …”
Section: Introductionmentioning
confidence: 99%
“…so a-STO has a broad application prospect. [8][9][10] Usually, good quality of oxide semiconductors was obtained by thermal annealing processes. Conventional thermal annealing requires long-term heat treatment at high temperatures, which may causes the surface of the material be contaminated, and the electrical properties of the substrate material are lowered by heating for a long time, 11 and the long-term heat accumulation makes the thermal annealing technique unsuitable for large-area panel process and flexible panel process.…”
Section: Introductionmentioning
confidence: 99%
“…Tin oxide (SnO 2 ) is regarded as a promising candidate for the channel layer of TFT because of its cheap and nontoxicity . However, poor electrical properties are obtained in SnO 2 TFTs due to excess carrier concentration and crystallization.…”
Section: Introductionmentioning
confidence: 99%
“…Tin oxide (SnO 2 ) has been regarded as a promising candidate for the channel layer of TFT because of its high optical transmittance, nontoxicity, and low cost . Due to excess carrier concentration and crystallization of SnO 2 , the silicon (Si) element as an excellent carrier suppressor material was incorporated into SnO 2 based on its bond‐dissociation energy with oxygen …”
Section: Introductionmentioning
confidence: 99%
“…6 Due to excess carrier concentration and crystallization of SnO 2 , the silicon (Si) element as an excellent carrier suppressor material was incorporated into SnO 2 based on its bond-dissociation energy with oxygen. [7][8][9][10] In addition, the contact properties at the Source/Drain (S/D) electrode/semiconductor interface is a key factor affecting device performance, which will become more prominent for scale-down device. A large contact resistance would hinder electron transport in the device and conduce to the degradation of device performance.…”
Section: Introductionmentioning
confidence: 99%