A novel micromachining technology for structuring borosilicate glass substrates

Abstract

We present a novel process technology, which enables precision micro machining of glass wafers. With this Glass Flow Process GFT [1,21, which is based on viscous deformation at temperatures above the glass transition temperature T,, any surface topography available on a silicon substrate can be moulded into Borosilicate glasses, especially into bondable glasses'like Borofloat' or Pyrex'. Beside the replication of silicon structures this technique allows the fabrication of optical micro lens arrays with high aspect ratios and minimum spacing. Introducing this GFP technology to MEMS processing enables the deep structuring of glass substrates and opens a wide range of new applications. Optical quality micro lenses with saggital heights above 100 pm are demonstrated.In this paper an insight description of the GFP technology is given and the functionality of this new technology is presented by optical measurements of micro lens demonstrators.

Modular packaging concept for MEMS and MOEMS

“…The aim is to develop a "kit" for the production of hermetically sealed, application specific wafer level (WL) housing for the construction of optical and mechanical components and systems. The production of the glass cover is hereby based on high temperature viscous glass micromachining with glass and silicon wafers [3], the micromechanical glass processing and a series of sequential bonding steps of glass and silicon wafers. This technology tool set enables the production of differently oriented, integrated windows on full 200 mm (8") wafers.…”

High-Q MEMS Resonators for Laser Beam Scanning Displays

“…Therefore, the design of a suitable glass cap wafer has to include deep cavities and windows of high optical quality. To enable low cost mass production of such glass cap wafers, a glass forming technology has been developed that uses a structured silicon wafer as a mold in a high temperature glass reflow process [9,10]. In the first step, several hundred microns deep trenches are etched into the surface of a polished silicon wafer ( Figure 5(a)).…”

Fabrication of Microlens Array and Its Application: A Review

“…Since the 1980s, the fabrication of microlens array is realized by different methods, such as Micro-electromechanical Systems (MEMS) based technologies [10][11][12][13][14][15][16][17] and ultraprecision machining technologies [18][19][20]. However, little work has been focused on the comparison of these method in terms of the surface finish, form error and the efficiency of production.…”