A novel microfluidic integration technology for PCB-based devices: Application to microflow sensing

Kontakis, Konstatinos; Πετρόπουλος, Αναστάσιος; Kaltsas, G.; Speliotis, Th.; Gogolides, Εvangelos

doi:10.1016/j.mee.2009.01.088

Cited by 43 publications

(107 citation statements)

References 9 publications

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“…Later, Bart et al introduced a novel room-temperature bonding technique based on chemically activated fluorinated ethylene propylene as an intermediate adhesive layer for glass and silicon substrates modified with APTES [114]. Kontakis et al bonded SU-8 microfluidic structures to a PMMA cover using a thin PMMA adhesive layer deposited on SU-8 structures by spin-coating [115]. Gutierrez-Rivera et al formed a 15 nm thick ''conformal adsorbate layer'' on KMPR Ò photoresist and used this thin layer to fabricate multilayer microfluidics by adhesive bonding [116].…”

Section: Sealing Using Adhesive Layersmentioning

confidence: 99%

Lab-on-a-chip devices: How to close and plug the lab?

Temiz

Lovchik

Kaigala

et al. 2015

Microelectronic Engineering

399

276

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a b s t r a c tLab-on-a-chip (LOC) devices are broadly used for research in the life sciences and diagnostics and represent a very fast moving field. LOC devices are designed, prototyped and assembled using numerous strategies and materials but some fundamental trends are that these devices typically need to be (1) sealed, (2) supplied with liquids, reagents and samples, and (3) often interconnected with electrical or microelectronic components. In general, closing and connecting to the outside world these miniature labs remain a challenge irrespectively of the type of application pursued. Here, we review methods for sealing and connecting LOC devices using standard approaches as well as recent state-of-the-art methods. This review provides easy-to-understand examples and targets the microtechnology/engineering community as well as researchers in the life sciences.

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Section: Sealing Using Adhesive Layersmentioning

confidence: 99%

Lab-on-a-chip devices: How to close and plug the lab?

Temiz

Lovchik

Kaigala

et al. 2015

Microelectronic Engineering

399

276

View full text Add to dashboard Cite

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“…First, the electrical components are fabricated on a PCB and then an SU-8 layer is coated on the PCB to planarize and aid the adherence of the fluidics which are subsequently patterned in an additional SU-8 layer. In one case, 86 platinum (Pt) resistors were fabricated on a PCB (by Pt sputtering followed by a lift-off process) to serve as temperature sensing elements. A microfluidic flow channel was then patterned on a second layer of SU-8 ( Fig.…”

Section: Technology Overview and Demonstrated Prototypesmentioning

confidence: 99%

The lab-on-PCB approach: tackling the μTAS commercial upscaling bottleneck

2017

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Commercialization of lab-on-a-chip devices is currently the "holy grail" within the μTAS research community. While a wide variety of highly sophisticated chips which could potentially revolutionize healthcare, biology, chemistry and all related disciplines are increasingly being demonstrated, very few chips are or can be adopted by the market and reach the end-users. The major inhibition factor lies in the lack of an established commercial manufacturing technology. The lab-on-printed circuit board (lab-on-PCB) approach, while suggested many years ago, only recently has re-emerged as a very strong candidate, owing to its inherent upscaling potential: the PCB industry is well established all around the world, with standardized fabrication facilities and processes, but commercially exploited currently only for electronics. Owing to these characteristics, complex μTASs integrating microfluidics, sensors, and electronics on the same PCB platform can easily be upscaled, provided more processes and prototypes adapted to the PCB industry are proposed. In this article, we will be reviewing for the first time the PCB-based prototypes presented in the literature to date, highlighting the upscaling potential of this technology. The authors believe that further evolution of this technology has the potential to become a much sought-after standardized industrial fabrication technology for low-cost μTASs, which could in turn trigger the projected exponential market growth of μTASs, in a fashion analogous to the revolution of Si microchips via the CMOS industry establishment.

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“…This technology allows the manufacturing of microsystems by the technique used in printed circuit technology. PCB-MEMS technologies have proven to be reliable to build relatively complex microfluidic systems at a low cost [9], [10]. It has a big potential because of the lower production and material costs in comparison to other technologies for microfluidics.…”

Section: Introductionmentioning

confidence: 99%

Towards a low-cost production of monodispersed microbubbles using PCB-MEMS technology

Villegas

Perdigones

Quero

2011

Proceedings of the 8th Spanish Conference on Electron Devices, CDE'2011

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This paper describes the fabrication process of a three-dimensional flow focusing device using the PCB-MEMS technology to produce microbubbles with a controlled diameter. The proposed process involves the typical photolithographic steps used in Printed Circuit Board (PCB) fabrication and a low temperature bonding technique based on tin/lead alloy. The fabricated device can be considered as low-cost nebulizer thank to the materials and bonding technique used in the fabrication process. The experimental results provide a diameter of the produced microbubbles of 230 and 250 μm. These results fit the microbubble flow focusing theory that predicts 226.71 and 245.66 μm .

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A novel microfluidic integration technology for PCB-based devices: Application to microflow sensing

Cited by 43 publications

References 9 publications

Lab-on-a-chip devices: How to close and plug the lab?

Lab-on-a-chip devices: How to close and plug the lab?

The lab-on-PCB approach: tackling the μTAS commercial upscaling bottleneck

Towards a low-cost production of monodispersed microbubbles using PCB-MEMS technology

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