A novel high resolution E-field microscope system with applications in HPA diagnostics

Abstract

Abstract-A new type of high resolution E-field microscope system is described. The system is based on a novel design of an active E-field probe (EFP) probe, which is both nonintrusive and displays high spatial resolution. This paper focuses on the construction and spatial resolution of the probe, which shows significant evolution from that previously reported [1], and some measurements on passive structures which indicate that features smaller than 100 microns can be individually resolved. The probe construction lends itself to further improvements in spatial resolution. Measurement results are presented which demonstrate the high resolution of the probe, and its potential utility in measuring waveforms with high spatial resolution at individual points on microwave circuits, discrete devices, and integrated circuits.

Near-Field Microwave Microscopy for 3D Surface Assessment of Manufactured Structures

“…It is proposed that by using this technology, with various measuring modes described below, it is possible to analyse structures such as small thread bores. The probes can be miniaturised in a similar manner to [29], where a coaxial probe was fabricated with a diameter of less than 1mm. This system also has the capability to investigate various materials, with metals and high permittivity materials having the greatest frequency shift of the probe (and hence greatest contrast relative to air) owing to the greater electrical polarisation of the sample's surface induced by the microwave electric field emanating from the probe's tip.…”

Double position-signal-difference method for electric near-field measurements

“…One of the most important parameters for electric near-field measurements is the broadband spatial resolution. Due to the continually increasing levels of integration of electrical components, higher spatial resolutions are required [11][12][13]. The spatial resolution in electric near-field measurements is basically determined by the size and structure of the probe.…”

Electro-Optic Near Field Imaging of High-Power RF/Microwave Transistors in Plastic Packages

“…Coaxial cable based assemblies, where a protruding center conductor acts as a monopole antenna, are sensitive to the normal E-field component and they have been used to probe the fields within air-cavity metal-ceramic packaged transistors [4], [6], [7]. These probes rely on capacitive coupling between the probe and the metalization of the device-under-test [8].…”