2013 International SoC Design Conference (ISOCC) 2013
DOI: 10.1109/isocc.2013.6864034
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A novel folded active inductor for wireless communication SoC

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“…However, the required values are feasible on-chip using MIM capacitors and spiral inductors [21]. Furthermore, in the microelectronic realization, the Q-factors of the inductors may be achieved by either active enhancement of on-chip coil inductors [22] or implementation of active inductors with gm-C type impedance inversion of fixed MIM capacitors [23], [24]. In both cases careful control of process tolerances (on-chip MIM capacitors have absolute and relative tolerances of ±25% and ±0.1% respectively), to ensure the desired group delay response, is necessary [21].…”
Section: Example 3: Equalization Of Measured Bpf Group Delay Responsementioning
confidence: 99%
“…However, the required values are feasible on-chip using MIM capacitors and spiral inductors [21]. Furthermore, in the microelectronic realization, the Q-factors of the inductors may be achieved by either active enhancement of on-chip coil inductors [22] or implementation of active inductors with gm-C type impedance inversion of fixed MIM capacitors [23], [24]. In both cases careful control of process tolerances (on-chip MIM capacitors have absolute and relative tolerances of ±25% and ±0.1% respectively), to ensure the desired group delay response, is necessary [21].…”
Section: Example 3: Equalization Of Measured Bpf Group Delay Responsementioning
confidence: 99%