A novel flip-chip interconnection technique using solder bumps for high-speed photoreceivers

Katsura, K.; Hayashi, Tsuyoshi; Ohira, Fumikazu; Hata, Satoshi; Iwashita, K.

doi:10.1109/50.59160

Cited by 54 publications

(8 citation statements)

References 2 publications

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“…Over the past decade, flip-chip packaging has become the technology of choice for producing broadband optical receiver and transmitter systems that require heterogeneous integration. 7 The small solder bump provides a short interconnection between the respective optoelectronic device and the supporting CMOS circuit. Typical values of the parasitic self-inductance (0.01-0.1nH) and…”

Section: Flip Chip Bonded Transceivermentioning

confidence: 99%

Integrated CMOS transmitter driver and diversity receiver for indoor optical wireless links

et al. 2002

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This paper describes the development and reports measured performance of integrated CMOS receiver and transmitter circuits for use in an optical wireless link operating at bit rates up to 310 Mb/s. The receiver presented is an angle-diversity design and consists of multiple sectors each driving an individual pre-amplifier channel. The speed limitation for the receiver circuit is determined substantially by the parasitic capacitance introduced by the photodetector. With current PIN devices this capacitance may be comparatively high, of order several picofarads as a relatively large field of view is required for optical wireless applications. The design incorporates an on-chip selector with external controls determined by the signal level. Signals from detectors that receive optical power above a certain threshold level are passed to a combiner circuit. In the transmitter, in order to avoid limiting the optical performance of the emitter, the electrical response of the LED driver is enhanced by current-peaking and charge-extraction circuitry. A novel timing generator is used to achieve fast rise and fall times. Experimental results confirm that the true performance evaluation of high-speed circuits can be severely hindered by parasitics associated with wire bonding and packaging of chips. Flip-chip packaging, advantageous for its small form factor and low capacitance leading to high speed has been investigated. This has led to the development of fully integrated receiver and transmitter systems where the photodetector and photoemitter devices are directly bonded to supporting CMOS substrates which furnish the necessary support electronics.

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Section: Flip Chip Bonded Transceivermentioning

confidence: 99%

Integrated CMOS transmitter driver and diversity receiver for indoor optical wireless links

et al. 2002

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“…polynomial D s has two complex-conjugate roots p , p and 1 2 a real one p , which are placed in the complex plane, as 3 shown in Figure 4. Substituting 6 and 5 into 3 , the following equation for T is obtained: For practical values of the parameters p , p , K Ј, the 10 20 Ž .…”

Section: Transimpedance Modelmentioning

confidence: 99%

“…13 , and then to use 12 to obtain a better estimation for p , 3 , . 13 , and then to use 12 to obtain a better estimation for p , 3 , .…”

Section: Transimpedance Modelmentioning

confidence: 99%

Yield optimization design procedure of MMIC transimpedance amplifiers for multigigabit optical receivers

Luzzi¹,

Marietti²,

Scotti³

et al. 2000

Microw. Opt. Technol. Lett.

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“…2(b), epi-side down bonding is recommended for effective heat transfer since the proximity of the active region is only a few microns from the surface (Hayashi, 1992;Lee & Basavanhally, 1994;Katsura, 1990). The proximity of the active region to the top of the heat sink strongly influences the heat flow.…”

mentioning

confidence: 99%

Advances in High-Power Laser Diode Packaging

Ronnie¹

2012

Semiconductor Laser Diode Technology and Applications

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A novel flip-chip interconnection technique using solder bumps for high-speed photoreceivers

Cited by 54 publications

References 2 publications

Integrated CMOS transmitter driver and diversity receiver for indoor optical wireless links

Integrated CMOS transmitter driver and diversity receiver for indoor optical wireless links

Yield optimization design procedure of MMIC transimpedance amplifiers for multigigabit optical receivers

Advances in High-Power Laser Diode Packaging

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