A novel epoxy encapsulant for CSP (μBGA(R))-new hydrophobic epoxy elastomer

Xu, Feng; Bymark, R.; Hsu, Bin-Lin

doi:10.1109/isapm.2000.869248

Cited by 2 publications

(2 citation statements)

References 2 publications

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“…For this reason, various WLPs are created to enhance the reliability. Tessera Inc. developed the well-known BGA package through the creative concept of a stress buffer layer between the bump array and the silicon, to release the thermal stress [10]. Flip Chip International made use of both two dielectric layers, one of polymer and one metallic layer to redistribute the input/output (I/O) pads of the UltraCSP WLP, and the lager solder ball is also used to increase its reliability [11].…”

Section: Introductionmentioning

confidence: 99%

3-D Structure Design and Reliability Analysis of Wafer Level Package With Stress Buffer Mechanism

Lee

Liu²,

Chiang³

2007

IEEE Trans. Comp. Packag. Technol.

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With the present trend of multifunction and minimizing of size, the conventional electronic package type no longer meets the requirement of the new-generation products. Consequently, new type packaging, based on the wafer level packages (WLPs) and chip scale packages (CSPs) technology are being developed to achieve these requirements, as well as long term reliability. Novel wafer-level chip scale packages (WLCSP) [1] with a stress buffer layer and bubble-like plate (Fig. 1) are proposed in this research to improve the solder joint fatigue life. The thermal stress caused by the coefficient of thermal expansion mismatch can be significantly reduced, and the reliability of the WLP could be substantially enhanced by this new design. In order to realize the relationship of the solder joint fatigue life, stress buffer layer and bubble-like plate, a finite element parametric analysis applying software ANSYS is utilized. In additions, the methodology based on the finite element method (FEM) used in the study has been verified by the relative experiments in our previous researches. The design parameters include the thickness of the stress buffer layer, thickness, bending angle and standoff height of the different types of bubble-like plate. The results of the FEM analysis reveal that the stress buffer layer and bubble-like plate can relax the thermal stresses of solder joints and enhance the package reliability. Besides, the peeling stress between stress buffer layer and two different types of bubble-like plates is discussed, and the stress state of the leadframe is also analyzed in this research. Furthermore, the findings of this research can be used as the guideline for advanced WLCSP design.Index Terms-Bubble-like stress buffer layer, chip scale packages (CSP), finite element method (FEM), reliability, simulation, wafer level packages (WLP).

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Section: Introductionmentioning

confidence: 99%

3-D Structure Design and Reliability Analysis of Wafer Level Package With Stress Buffer Mechanism

Lee

Liu²,

Chiang³

2007

IEEE Trans. Comp. Packag. Technol.

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show abstract

“…For this reason, various WLPs are created to enhance the reliability. Tessera Inc. developed the well-known /1 BGA package through the creative concept of a stress buffer layer between the bump array and the silicon, to release the thermal stress [9]. Kulicke & Soffa Inc. made use of both two dielectric layers, one of polymer and one metallic layer to redistribute the 110 pads of the UltraCSP WLP, and the lager solder ball is also used to increase its reliability [IO].…”

Section: Introductionmentioning

confidence: 99%

3D structure design and reliability analysis of wafer level package with bubble-like stress buffer layer

Lee

Liu

Yew³

et al.

The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (IEEE Cat. No.04CH37543)

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With the present trend of multi-function and minimizing of size, the conventional electronic package type no longer meets the requirement of the new-generation products.Consequently, new type packaging, based on the wafer level packages (WLP) and chip scale packages (CSP) technology are being developed to achieve these requirements, as well as long term reliability. Novel wafer-level chip scale packages (WLCSP) with a stress buffer layer and bubble-like plate ( Figure 1) are proposed in this research to improve the solder joint fatigue life. The thermal stress caused by the coefficient of thermal expansion ( CTE ) mismatch can be significantly reduced, and the reliability of the WLP could be substantially enhanced by this new design. In order to realize the relationship of the solder joint fatigue life, stress buffer layer and bubble-like plate, a finite element parametric analysis applying software ANSYS"is utilized. The design parameters include the thickness of the stress buffer layer, thickness, bending angle and standoff height of the different types of bubble-like plate. The results of the finite element method (FEM) analysis reveal that the stress buffer layer and bubblelike plate can relax the thermal stresses of solder joints and enhance the package reliability. In addition, the peeling stress between stress buffer layer and two different types of bubblelike plates is discussed, and the stress state of the leadframe is also analyzed in this research. Furthermore, the findings of this research can he used as the guideline for advanced WLCSP design.

show abstract

A novel epoxy encapsulant for CSP (μBGA(R))-new hydrophobic epoxy elastomer

Cited by 2 publications

References 2 publications

3-D Structure Design and Reliability Analysis of Wafer Level Package With Stress Buffer Mechanism

3-D Structure Design and Reliability Analysis of Wafer Level Package With Stress Buffer Mechanism

3D structure design and reliability analysis of wafer level package with bubble-like stress buffer layer

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