A novel electro-thermal simulation approach of power IGBT modules for automotive traction applications

Kojima,; Yamada,; Ciappa,; Chiavarini,; Fichtner,

doi:10.1109/wct.2004.239990

Cited by 45 publications

(19 citation statements)

References 2 publications

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“…The starting point of the procedure was a static 3-D finite-element thermal model of the converter, including the module and the heat sink [79], [80]. This model was initially calibrated with experimental data, acquired by infrared thermography or internal thermometry techniques.…”

Section: A Thermal and Electrothermal Modelsmentioning

confidence: 99%

Condition Monitoring for Device Reliability in Power Electronic Converters: A Review

Yang

Xiang

Bryant

et al. 2010

IEEE Trans. Power Electron.

988

382

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Condition monitoring (CM) has already been proven to be a cost effective means of enhancing reliability and improving customer service in power equipment, such as transformers and rotating electrical machinery. CM for power semiconductor devices in power electronic converters is at a more embryonic stage; however, as progress is made in understanding semiconductor device failure modes, appropriate sensor technologies, and signal processing techniques, this situation will rapidly improve. This technical review is carried out with the aim of describing the current state of the art in CM research for power electronics. Reliability models for power electronics, including dominant failure mechanisms of devices are described first. This is followed by a description of recently proposed CM techniques. The benefits and limitations of these techniques are then discussed. It is intended that this review will provide the basis for future developments in power electronics CM.

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Section: A Thermal and Electrothermal Modelsmentioning

confidence: 99%

Condition Monitoring for Device Reliability in Power Electronic Converters: A Review

Yang

Xiang

Bryant

et al. 2010

IEEE Trans. Power Electron.

988

382

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“…A transient heat 3D-FEM simulation of the IGBT module with a laboratory heat sink is carried out. The transient response of temperature at each layer of a single IGBT module with heat-sink is shown in Figure 17 [2], where, a 100 W step changed heat source is applied, based on Figure 18 is assumed to be connected with the Phase-A upper side IGBT, so power loss of phase-A upper side IGBT is considered as input heat source to the thermal network, the ambient temperature T amb is set to be 258C: With Model-1 thermal simulation, the power losses are directly from the circuit simulation and are shown in Figure 19(a). With Model-2 thermal simulation, the average power losses over each PWM switching cycle ð1 msÞ is calculated based on the compact model characteristics in Figures 11 and 12 using proposed lookup table method and PWM reconstruction technique and is shown in Figure 20(a).…”

Section: Thermal Simulation and Comparisonmentioning

confidence: 99%

“…To determine the losses, an accurate approach is to simulate a circuit by using physically based device model [2][3][4], however, due to the complicated physical switching process, and the very fast transient period, the determination of power losses requires very small simulation time steps (in the order of nanoseconds), this results in an unacceptably large CPU times and memory storage; for a multi-device power electronics systems the problem is even more intractable. At the other end of the scale it is common to use device data-sheets, provided by manufacturers, to estimate losses [5].…”

Section: Introductionmentioning

confidence: 99%

A fast power loss calculation method for long real time thermal simulation of IGBT modules for a three-phase inverter system

Zhou¹,

Khanniche²,

Igić³

et al. 2005

Int. J. Numer. Model.

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SUMMARYA fast power losses calculation method for long real time thermal simulation of IGBT module for a threephase inverter system is presented in this paper. The speed-up is obtained by simplifying the representation of the three-phase inverter at the system modelling stage. This allows the inverter system to be simulated predicting the effective voltages and currents whilst using large time-step. An average power losses is calculated during each clock period, using a pre-defined look-up table, which stores the switching and on-state losses generated by either direct measurement or automatically based upon compact models for the semiconductor devices. This simulation methodology brings together accurate models of the electrical systems performance, state of the art-device compact models and a realistic simulation of the thermal performance in a usable period of CPU time and is suitable for a long real time thermal simulation of inverter power devices with arbitrary load. Thermal simulation results show that with the same IGBT characteristics applied, the proposed model can give the almost same thermal performance compared to the full physically based device modelling approach.

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“…These simulators require a dense discretisation mesh to analyse complex structures and to provide accurate results. However, they are of limited use in converter design due to the long computation time required to simulate realistic load cycles [2]. Also they cannot be integrated easily into converter circuit simulation.…”

Section: Introductionmentioning

confidence: 99%

3-D thermal simulation of power module packaging

Swan

Bryant

Parker-Allotey

et al. 2009

2009 IEEE Energy Conversion Congress and Exposition

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This paper describes the development and implementation of an analytical 3-D thermal model for fast and accurate thermal simulation of power device modules in electrothermal converter simulation. A Fourier-based solution is used to solve the 3-D heat equation. The solution can describe the variation of temperature through the whole IPM structure with time. The model can simulate thermal interactions resulting from multiple heat sources. The thermal model is extremely fast to simulate compared to finite-element (FEM) approaches. The new model has been implemented in MATLAB/Simulink in order to co-simulate with the converter model which is in the same form. The model has been validated against the CFD software package FLOTHERM and shows good agreement. The required aspects of 3-D heat diffusion are captured successfully by the Fourier-based model.

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A novel electro-thermal simulation approach of power IGBT modules for automotive traction applications

Cited by 45 publications

References 2 publications

Condition Monitoring for Device Reliability in Power Electronic Converters: A Review

Condition Monitoring for Device Reliability in Power Electronic Converters: A Review

A fast power loss calculation method for long real time thermal simulation of IGBT modules for a three-phase inverter system

3-D thermal simulation of power module packaging

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