1998
DOI: 10.1109/22.704944
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A novel dimension-reduction technique for the capacitance extraction of 3-D VLSI interconnects

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Cited by 39 publications
(2 citation statements)
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“…The VLSI structure had fine geometric details in all dimensions (Figure 8). Thus, a micron-scale mesh size must be employed for the accuracy simulation [32]. The VLSI interconnect model had dimensions of 400 × 240 × 244.64 nm in each direction.…”
Section: Wave Propagation Problem-very Large Scale Integration (Vlsi)...mentioning
confidence: 99%
See 1 more Smart Citation
“…The VLSI structure had fine geometric details in all dimensions (Figure 8). Thus, a micron-scale mesh size must be employed for the accuracy simulation [32]. The VLSI interconnect model had dimensions of 400 × 240 × 244.64 nm in each direction.…”
Section: Wave Propagation Problem-very Large Scale Integration (Vlsi)...mentioning
confidence: 99%
“…This cannot be realized when employing conventional algorithms. The introduction of unconditionally stable algorithms can be regarded as an effective way to overcome this obstacle [32].…”
Section: Wave Propagation Problem-very Large Scale Integration (Vlsi)...mentioning
confidence: 99%