A Novel Conditional Probability Density Distribution Surface for the Analysis of the Drop Life of Solder Joints Under Board Level Drop Impact

Gu, Ji; Liu, Yongping; Lin, Jian; Fu, Hanguang; Wu, Zhongwei

doi:10.1007/s11664-015-4012-1

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A Novel Conditional Probability Density Distribution Surface for the Analysis of the Drop Life of Solder Joints Under Board Level Drop Impact

Cited by 5 publications

References 21 publications

A Novel P-S-N Curve Estimation Method Considering Heteroscedasticity for High-Cycle Fatigue Circumstances

A Novel P-S-N Curve Estimation Method Considering Heteroscedasticity for High-Cycle Fatigue Circumstances

Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints

Development of lead-free interconnection materials in electronic industry during the past decades: Structure and properties

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