A novel approach to extracting hardness of copper/niobium (Cu/Nb) multilayer films by removing the substrate effect

Qiu, Y.H.; Bai, Qingwen; Fu, Engang; Wang, P.P.; Du, Jinlong; Chen, X.F.; Xue, Jianming; Wang, Y.G.; Wang, X.J.

doi:10.1016/j.msea.2018.03.047

Cited by 11 publications

(6 citation statements)

References 28 publications

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“…This phenomenon can be interpreted as indentation size effect (ISE) which is common in the crystalline materials [36]. When the depth is in the range of 100–500 nm, an almost flat profile is obtained and the hardness values of the samples are extracted in the flat region [37]. The enlarged profile of the indentation depth ranging from 200 nm to 500 nm is shown in the top-right inset to observe the difference in hardness of the samples clearly.…”

Section: Resultsmentioning

confidence: 99%

“…This means a high volume fraction of grain boundary exists in the film. Grain boundary plays an important role in preventing the slip of dislocations in the films, and thus the hardness of HEF with a larger grain boundary density should be larger [37,38]. As the grain size of samples #3 and #4 is larger than that of sample #5, the density of grain boundary is less, leading to the lower hardness.…”

Section: Resultsmentioning

confidence: 99%

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Growth Mechanisms and the Effects of Deposition Parameters on the Structure and Properties of High Entropy Film by Magnetron Sputtering

Liang

Wang

et al. 2019

Materials

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Despite intense research on high entropy films, the mechanism of film growth and the influence of key factors remain incompletely understood. In this study, high entropy films consisting of five elements (FeCoNiCrAl) with columnar and nanometer-scale grains were prepared by magnetron sputtering. The high entropy film growth mechanism, including the formation of the amorphous domain, equiaxial nanocrystalline structure and columnar crystal was clarified by analyzing the microstructure in detail. Besides, the impacts of the important deposition parameters including the substrate temperature, the powder loaded in the target, and the crystal orientation of the substrate on the grain size and morphology, phase structure, crystallinity and elemental uniformity were revealed. The mechanical properties of high entropy films with various microstructure features were investigated by nanoindentation. With the optimized grain size and microstructure, the film deposited at 350 °C using a power of 100 W exhibits the highest hardness of 11.09 GPa. Our findings not only help understanding the mechanisms during the high entropy film deposition, but also provide guidance in manufacturing other novel high entropy films.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Growth Mechanisms and the Effects of Deposition Parameters on the Structure and Properties of High Entropy Film by Magnetron Sputtering

Liang

Wang

et al. 2019

Materials

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“…Alternatives are based on a geometrical description of the edge-effect-affected zone. These have been proposed by [ 62 ] and later modified and refined [ 66 ]. With reference to Figure 3 , we assume a Berkovich indentation BCF, with measured indentation height h and pile-up height h pile-up .…”

Section: Introductionmentioning

confidence: 99%

Metrological Comparison of Available Methods to Correct Edge-Effect Local Plasticity in Instrumented Indentation Test

et al. 2023

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The Instrumented Indentation Test (IIT) mechanically characterizes materials from the nano to the macro scale, enabling the evaluation of microstructure and ultra-thin coatings. IIT is a non-conventional technique applied in strategic sectors, e.g., automotive, aerospace and physics, to foster the development of innovative materials and manufacturing processes. However, material plasticity at the indentation edge biases the characterization results. Correcting such effects is extremely challenging, and several methods have been proposed in the literature. However, comparisons of these available methods are rare, often limited in scope, and neglect metrological performance of the different methods. After reviewing the main available methods, this work innovatively proposes a performance comparison within a metrological framework currently missing in the literature. The proposed framework for performance comparison is applied to some available methods, i.e., work-based, topographical measurement of the indentation to evaluate the area and the volume of the pile-up, Nix–Gao model and the electrical contact resistance (ECR) approach. The accuracy and measurement uncertainty of the correction methods is compared considering calibrated reference materials to establish traceability of the comparison. Results, also discussed in light of the practical convenience of the methods, show that the most accurate method is the Nix–Gao approach (accuracy of 0.28 GPa, expanded uncertainty of 0.57 GPa), while the most precise is the ECR (accuracy of 0.33 GPa, expanded uncertainty of 0.37 GPa), which also allows for in-line and real-time corrections.

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“…In recent years, the Cu based metallic multilayer films have aroused the researchers' attention as the promising materials meeting the requirement for the harsh environment, owing to their desirable properties, such as high toughness, stable chemical inertness, and good adhesion [1][2][3]. However, for the severe tribo-applications, the service life of these metallic multilayer films is limited because of the relative low hardness and wear resistance [4,5]. Compared with the metallic multilayer films, the metallic-ceramic multilayer films exhibit higher hardness and better wear resistance, which are viable for the tribo-applications for the surface of the moving parts (such as bearings, pistons, and gears) [6][7][8].…”

Section: Introductionmentioning

confidence: 99%

Improved the Wear Resistance of Ti/Cu Multilayer Film by Nitriding

Fang

Zhao

2022

Coatings

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In this study, Ti/Cu multilayer film was deposited by magnetron sputtering and then nitrided at 800 and 900 °C in N2. The microstructure and wear performance were studied. The deposited Ti/Cu multilayer film mainly consisted of Ti and Cu phases. After nitriding, the film mainly consisted of Cu4Ti3, CuTi, and TiN phases, indicating the interface reaction and nitriding reaction occurring. The surface microstructure of the Ti/Cu multilayer film became denser after nitridation. The wear resistance of the Ti/Cu multilayer film improved after nitriding. After nitriding at 900 °C for 2 h, the maximum wear track depth of the multilayer film was ~0.73 μm, which is just 65% of the deposited Ti/Cu multilayer film. The wear mechanism of the Ti/Cu multilayer film before and after nitriding was abrasive and adhesive wear.

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A novel approach to extracting hardness of copper/niobium (Cu/Nb) multilayer films by removing the substrate effect

Cited by 11 publications

References 28 publications

Growth Mechanisms and the Effects of Deposition Parameters on the Structure and Properties of High Entropy Film by Magnetron Sputtering

Growth Mechanisms and the Effects of Deposition Parameters on the Structure and Properties of High Entropy Film by Magnetron Sputtering

Metrological Comparison of Available Methods to Correct Edge-Effect Local Plasticity in Instrumented Indentation Test

Improved the Wear Resistance of Ti/Cu Multilayer Film by Nitriding

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