“…While device fabrication has been empirically refined to meet strict quality demands, the fundamental understanding of the modifications in the TMR structure introduced by various optimization processes, e.g., postannealing [8][9][10][11][12][13][14][15][16], resulting in a different magnitude of the TMR [10,11], is still missing. In particular, the behavior of boron, apparently playing a crucial role for high magnetoresistance, has remained controversial in spite of extensive investigations [12,13,[15][16][17][18][19][20][21][22][23][24]. For example, it has been suggested that B diffusion is integral to the creation of a textured CoFe alloy and consequently, high TMR.…”