“…The SCEs, which mainly includes the threshold voltage roll-off, the drain induced barrier lowering (DIBL), and the subthreshold swing degradation, is the major barrier for MOSFET downscaling. Therefore, based on the UTBB SOI technology, a number of methods have been proposed to further reduce the SCEs, by employing the channel engineering, the source/drain engineering (Yamada et al 2013b, c;Srivastava et al 2016), the back-biasing technique (Burignat et al 2010;Karatsori et al 2015), the thickness modulation of the buried oxide layer (Yamada et al 2013a), and the gate voltage difference engineering (Anvarifard et al 2009;Anvarifard and Orouji 2013;Lahgere et al 2015).…”