A New Silicone Gel Sealing Mechanism for High Reliability Encapsulation

Ōtsuka, Kanji; Shirai, Y.; Okutani, Katsunobu

doi:10.1109/tchmt.1984.1136362

Cited by 27 publications

(3 citation statements)

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“…Due to their intrinsic low modulus and soft gel-like nature, silicone gels have become very effective,encapsulants for the delicate large chip size and wire-bonded VLSI chip. [4][5][6] AT&T, Hitachi, Burroughs, GM Delco, to name a few, have been using silicone gels for sometime with excellent results. These silicone gels have excellent environment acceleration test results on silicon-on-silicon CMOS module devices (See Table III.5I…”

Section: High Performance Silicone -A Potential For Replacement Of Cementioning

confidence: 99%

“…By addition of an excess of inert silicone oil (methyl-terminated polydimethyl siloxane), Hitachi scientists [4][5][6] have improved all the environment acceleration test results (See above Table III). The excess of the inert silicone oil passivated the IC device and provided the protection in all these environment testings.…”

Section: High Performance Silicone -A Potential For Replacement Of Cementioning

confidence: 99%

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High Performance Silicone Gel as IC Device Chip Protection

Wong

1987

MRS Proc.

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Recent advances in IC device encapsulants and polymeric materials have made high reliability VLSI plastic packaging a reality. High performance silicone gel possesses excellent electrical and physical properties for IC protection. With their intrinsic low modulus and soft gel-like nature, silicone gels have become very effective encapsulants for the delicate larger chip size and wire-bonded VLSI chips. Recent studies indicate that adequate IC chip surface protection with high performance silicone gels in plastic packaging could possibly replace conventional ceramic: hermetic packaging. This paper will review some potential IC encapsulants. Special focus will be placed on the high performance silicone gel, its chemistry, and its application as a VLSI device encapsulant.

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Section: High Performance Silicone -A Potential For Replacement Of Cementioning

confidence: 99%

Section: High Performance Silicone -A Potential For Replacement Of Cementioning

confidence: 99%

High Performance Silicone Gel as IC Device Chip Protection

Wong

1987

MRS Proc.

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“…Optical, electronic devices and electrical modules are continuously evolving in functionality and achieving high performance while tending to be smaller and more integrated [ 1 , 2 , 3 , 4 ]. These devices are generally encapsulated with polymeric potting materials to achieve heat transfer and avoid environmental damages (e.g., moisture penetration and mechanical damage), thus boosting their long-term reliability [ 5 , 6 , 7 ]. Addition-cured liquid silicone rubber (LSR) possesses an amazing array of properties including a high dielectric breakdown strength, flame resistance, heat and cold resistance, stress relieving properties and long-lasting durability, which make it one of the most promising materials for the protection of electronic devices [ 8 , 9 ].…”

Section: Introductionmentioning

confidence: 99%

Binary Promoter Improving the Moderate-Temperature Adhesion of Addition-Cured Liquid Silicone Rubber for Thermally Conductive Potting

Zheng

Wang²,

Nie³

et al. 2022

Materials

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The strong adhesion of thermally conductive silicone encapsulants on highly integrated electronic devices can avoid external damages and lead to an improved long-term reliability, which is critical for their commercial application. However, due to their low surface energy and chemical reactivity, the self-adhesive ability of silicone encapsulants to substrates need to be explored further. Here, we developed epoxy and alkoxy groups-bifunctionalized tetramethylcyclotetrasiloxane (D4H-MSEP) and boron-modified polydimethylsiloxane (PDMS-B), which were synthesized and utilized as synergistic adhesion promoters to provide two-component addition-cured liquid silicone rubber (LSR) with a good self-adhesion ability for applications in electronic packaging at moderate temperatures. The chemical structures of D4H-MSEP and PDMS-B were characterized by Fourier transform infrared spectroscopy. The mass percentage of PDMS-B to D4H-MSEP, the adhesion promoters content and the curing temperature on the adhesion strength of LSR towards substrates were systematically investigated. In detail, the LSR with 2.0 wt% D4H-MSEP and 0.6 wt% PDMS-B exhibited a lap-shear strength of 1.12 MPa towards Al plates when curing at 80 °C, and the cohesive failure was also observed. The LSR presented a thermal conductivity of 1.59 W m−1 K−1 and good fluidity, which provided a sufficient heat dissipation ability and fluidity for potting applications with 85.7 wt% loading of spherical α-Al2O3. Importantly, 85 °C and 85% relative humidity durability testing demonstrated LSR with a good encapsulation capacity in long-term processes. This strategy endows LSR with a good self-adhesive ability at moderate temperatures, making it a promising material requiring long-term reliability in the encapsulation of temperature-sensitive electronic devices.

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Package Sealing and Encapsulation

Kumar¹,

Ozmat²

1989

Microelectronics Packaging Handbook

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A New Silicone Gel Sealing Mechanism for High Reliability Encapsulation

Cited by 27 publications

References 1 publication

High Performance Silicone Gel as IC Device Chip Protection

High Performance Silicone Gel as IC Device Chip Protection

Binary Promoter Improving the Moderate-Temperature Adhesion of Addition-Cured Liquid Silicone Rubber for Thermally Conductive Potting

Package Sealing and Encapsulation

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