A new packaging technology using micro-solder bumps for high-speed photoreceivers

Tsunetsugu, H.; Katsura, K.; Hayashi, Tsuyoshi; Ishitsuka, F.; Hata, Satoshi

doi:10.1109/33.159888

Cited by 21 publications

(4 citation statements)

References 6 publications

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“…Type A consists of an LD chip directly bonded onto a driver chip by microsolder bumps. The electrical interconnection is achieved only by one small bump and the microstrip on each device; this is the same as for the microsolder bump bonded PIN PDamplifiers we have previously demonstrated [38]- [40]. Type B consists of an LD chip, a driver chip, and a substrate, where the devices are bonded onto the substrate by the microsolder bumps.…”

Section: New Hybrid Integrated Ld-driversmentioning

confidence: 99%

“…One way to overcome this problem is microsolder bump bonding. Hybrid integrated PIN PD-amplifiers using this technique have already been demonstrated [37]- [40]. Their detection bandwidths are superior because microsolder bump Conventional structure of a hybrid integrated LD-driver using wire electrodes between devices have very low parasitic inductance and capacitance.…”

Section: Introductionmentioning

confidence: 97%

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New hybrid integrated laser diode-drivers using microsolder bump bonding: SPICE simulation of high-speed modulation characteristics

Hayashi¹,

Katsura²,

Tsunetsugu³

1994

J. Lightwave Technol.

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This paper proposes two types of new hybrid integrated laser diode (LD)-drivers that use microsolder bump bonding instead of conventional wire bonding. In one, an LD and a driver are flip-chip bonded to each other; in the other, an LD and a driver are flip-chip bonded onto a substrate. Their performances are compared to those of a monolithic LDdriver and a conventional hybrid one using wire bonding by a simulation program with integrated circuit emphasis (SPICE) with particular emphasis on high-speed LD modulation. The nonreturn-to-zero (NRZ) eye patterns modulated at signal speeds up to 30 Gb/s by the new hybrid integrated LD-drivers were hardly inferior to those by the monolithic LD-driver, whereas those by conventional hybrid ones were greatly degraded over 10 Gb/s. The new hybrid integrated LD-drivers are a feasible alternative to monolithic ones for high-speed optical transmitters.

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Section: New Hybrid Integrated Ld-driversmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 97%

New hybrid integrated laser diode-drivers using microsolder bump bonding: SPICE simulation of high-speed modulation characteristics

Hayashi¹,

Katsura²,

Tsunetsugu³

1994

J. Lightwave Technol.

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“…This paper was recommended for publication by Editor S. Canumalla upon evaluation of the reviewers' comments. This work was presented at the 49th Electronic Components and Technology Conference San Diego, CA, June [1][2][3][4]1999.…”

Section: Introductionmentioning

confidence: 98%

Advanced flip chip bonding techniques using transferred microsolder bumps

Koshoubu

Ishizawa

Tsunetsugu

et al. 2000

IEEE Trans. Comp. Packag. Technol.

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For future high-speed and high-density opto-electronic multi-chip module (OE-MCM) packaging, we developed two advanced transferred microsolder bump bonding techniques. One uses 80% Au-Sn, which allows module packaging using processes at various temperatures because it has a higher melting temperature than 100% In and 60% Sn-Pb solders. The other uses multiple transfers of bumps to achieve accurate three-dimensional flip-chip bonding with precise vertical and horizontal alignments within an error of 0 5 m. These techniques will thus be very useful in developing high-speed and high-density OE-MCM's for multi-functional board-level interconnection in future optical communication systems.Index Terms-Flip chip, microelectric packaging, OE-MCM, optical alignment, self alignment, solder bump.

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“…In particular, flip-chip bonding is very useful in ultrahigh-speed and high-frequency applications. Previously, many kinds of optical modules such as IO-Gb/s-class optical receiver modules using solder bumps have been developed [3]- [5]. However, in the flip-chip structure, as the signal transmission speed increases, excessive capacitive elements appear due to the facing signal transmission lines and ground conductors near the solder bumps.…”

Section: Introductionmentioning

confidence: 99%

Packaging technology for 40-Gb/s optical receiver module with an MU-connector interface

Iwasaki

Yanagibashi

Tsunetsugu

et al.

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)

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A compact 40-Gb/s optical receiver module with an MUconnector interface has been developed. Its packaging has three main technical features. (I) Coplanar waveguide (CPW) patterns of the waveguide photodiode (WG-PD) and of the preamplifier IC in the facing a m of the flip-chip structure are optimized for impedance matching. (2) A film carrier is used to connect the preamplifier IC to an electrical coaxial connector for electrical signal output. (3) An MU-connector is used as the optical interface to reduce the module size. Optimum design enabled a module size of 14.0 mm wide, 40.4 mm long, and 9.65 mm high. Measurements showed a 3-dB down bandwidth of the optical/electrical response of at least 50 GHz and a clear open eye pattern for a 40-Gbls non-returnto-zero (NU) signal input. This optical receiver module is suitable for large-capacity communication network systems.

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A new packaging technology using micro-solder bumps for high-speed photoreceivers

Cited by 21 publications

References 6 publications

New hybrid integrated laser diode-drivers using microsolder bump bonding: SPICE simulation of high-speed modulation characteristics

New hybrid integrated laser diode-drivers using microsolder bump bonding: SPICE simulation of high-speed modulation characteristics

Advanced flip chip bonding techniques using transferred microsolder bumps

Packaging technology for 40-Gb/s optical receiver module with an MU-connector interface

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