Packaging technology for 40-Gb/s optical receiver module with an MU-connector interface

Abstract

A compact 40-Gb/s optical receiver module with an MUconnector interface has been developed. Its packaging has three main technical features. (I) Coplanar waveguide (CPW) patterns of the waveguide photodiode (WG-PD) and of the preamplifier IC in the facing a m of the flip-chip structure are optimized for impedance matching. (2) A film carrier is used to connect the preamplifier IC to an electrical coaxial connector for electrical signal output. (3) An MU-connector is used as the optical interface to reduce the module size. Optimum design enabled a module size of 14.0 mm wide, 40.4 mm long, and 9.65 mm high. Measurements showed a 3-dB down bandwidth of the optical/electrical response of at least 50 GHz and a clear open eye pattern for a 40-Gbls non-returnto-zero (NU) signal input. This optical receiver module is suitable for large-capacity communication network systems.

Modelling and O/E characterization of 40-Gbps InGaAs side-illuminated waveguide photodiode and submodule for optical receivers

“…Jiang et al reported on a high-power waveguide integrated photodiode [4]. Iwasaki et al studied on packaging technology for optical receiver module [5]. However, there has not been any report on measurement-based circuit model for WGPD submodule on the basis of equivalent circuit model of WGPD.…”