A new multichip module using a copper polyimide multilayer substrate

Sasaki, Shigenobu; Kon, T.; Ohsaki, T.; Yasuda, T.

doi:10.1109/33.49030

Cited by 21 publications

(2 citation statements)

References 10 publications

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“…Historically, polyimide was first used in microelectronics as an insulator and then as a packaging material for planarization in multilevel interconnects [219][220][221] and to form multichip modules [222]. Another early application of polyimide was as molded grating patterned x-ray masks [223].…”

Section: Polyimidementioning

confidence: 99%

Review of polymer MEMS micromachining

Kim

Meng

2015

J. Micromech. Microeng.

127

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The development of polymer micromachining technologies that complement traditional silicon approaches has enabled the broadening of microelectromechanical systems (MEMS) applications. Polymeric materials feature a diverse set of properties not present in traditional microfabrication materials. The investigation and development of these materials have opened the door to alternative and potentially more cost effective manufacturing options to produce highly flexible structures and substrates with tailorable bulk and surface properties. As a broad review of the progress of polymers within MEMS, major and recent developments in polymer micromachining are presented here, including deposition, removal, and release techniques for three widely used MEMS polymer materials, namely SU-8, polyimide, and Parylene C. The application of these techniques to create devices having flexible substrates and novel polymer structural elements for biomedical MEMS (bioMEMS) is also reviewed.

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Section: Polyimidementioning

confidence: 99%

Review of polymer MEMS micromachining

Kim

Meng

2015

J. Micromech. Microeng.

127

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“…Polyimide was first used as a buffer coating layer in EMC (Epoxy Molding Compound) protection applications [4]. It is necessary for protection in IC substrate (PSPI acts like encapsulation) from filler attack and for planarization in multilevel interconnects [5,6]. The application also explored as a fixable…”

Section: Introductionmentioning

confidence: 99%

Low-stress photosensitive polyimide suspended membrane for improved thermal isolation performance

Fan¹,

Xing²,

Wu³

et al. 2017

J. Micromech. Microeng.

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In this paper, we introduce a method of isolating thermal conduction from silicon substrate for accommodating thermal-sensitive micro-devices. This method lies in fabrication of a low-stress photosensitive polyimide (PSPI) suspension structure which has lower thermal conductivity than silicon. First, a PSPI layer was patterned on a silicon wafer and hard baked. Then, a cavity was etched from the backside of the silicon substrate to form a membrane or a bridge-shape PSPI structure. After releasing, a slight deformation of about 20 nm was observed in the suspended structures, suggesting ultralow residual stress which is essential for accommodating micro-devices. In order to investigate the thermal isolation performance of the suspended PSPI structures, micro Pirani vacuum gauges, which are thermal-sensitive, had been fabricated on the PSPI structures. The measurement results illustrated that the Pirani gauges worked as expected in the range from 1– 470 Pa. Moreover, the results of the Pirani gauges based on the membrane and bridge structures were comparable, indicating that the commonly used bridge-shape structure for further reducing thermal conduction was unnecessary. Due to the excellent thermal isolation performance of PSPI, the suspended PSPI membrane is promising to be an outstanding candidate for thermal isolation applications.

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