2008
DOI: 10.1109/tmtt.2008.2006802
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A New Low Loss Rotman Lens Design Using a Graded Dielectric Substrate

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Cited by 54 publications
(40 citation statements)
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“…Traditional mechanical machining and micromachining have been up to now the dominant approach for fabrication [6,7]. These machining techniques remove or shape parts of raw materials using operations such as drilling and milling.…”
Section: Introductionmentioning
confidence: 99%
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“…Traditional mechanical machining and micromachining have been up to now the dominant approach for fabrication [6,7]. These machining techniques remove or shape parts of raw materials using operations such as drilling and milling.…”
Section: Introductionmentioning
confidence: 99%
“…[4] and XG-PON in ITU-T G.987 [5] rec. All these PON types mentioned above are based on time-division multiplex (TDM) principle while both upstream and downstream TDM frames consist of multiple contributions to/from all active end-points optical network units (ONUs) [6]. Therefore, a part of the optical distribution network (ODN) is always shared by multiple ONUs.…”
Section: Introductionmentioning
confidence: 99%
“…Synthesized dielectrics with both small and large sized holes produced identical radiation patterns [23]. Rotman lenses [24] are an important component of many beam forming networks and have been utilised in various applications including multi-beam receivers, beam steering antenna systems and automotive radar systems [25,26]. Heterogeneous dielectrics have been employed to reduce the insertion loss in comparison with a homogeneous substrate Rotman lens.…”
Section: Heterogeneous Substrates Prepared By Drilling Holesmentioning
confidence: 99%
“…A gradient of permittivities, as indicated in Figure 3(a), was synthesized by varying the density of drilled holes in the substrate and used to bend the rays with in the lens for improved focussing. This also decreased the power loss due to spill-over to the side ports [26]. Layered heterogeneous substrates, as in Figure 3(b), were synthesized using low temperature co-fired ceramics (LTCC) processing.…”
Section: Heterogeneous Substrates Prepared By Drilling Holesmentioning
confidence: 99%
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