A New EMI Modeling Method for Mixed-Mode Noise Analysis in Three-Phase Inverter System

Wu, Zhou; Pei, Xuejun; Xiang, Yong; Kang, Yong

doi:10.1109/access.2020.2983084

Cited by 24 publications

(10 citation statements)

References 25 publications

(35 reference statements)

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“…The behavior model of IGBT chip in the stage of rapid current decline can be equivalent to a time-varying current source with parasitic capacitance [7,15], as shown in Fig. 3.…”

Section: Root Reasons Of Dm Interferencementioning

confidence: 99%

Aging Monitoring of Bond Wires Based on Emr Signal Spectrum Characteristics for Igbt Module

Ren¹,

Du²,

Yin³

et al. 2022

PIER

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Bond wires aging is one of the most common failure modes of insulated gate bipolar transistor (IGBT) module. Real-time monitoring of bond wires status is an important guarantee for the stable operation of power electronics system. In this paper, a method of monitoring the aging state of bond wires in IGBT module based on the spectrum characteristics of electromagnetic radiation (EMR) signature is proposed. Firstly, the turn-off process of IGBT module is analyzed, and the behavior model of IGBT module in the stage of rapid current change is established, which shows that EMR interference in buck converter mainly occurs during the turn-off process of IGBT module. Secondly, the relationship between the aging degree of bond wires and differential mode (DM) interference signal is deduced. Thirdly, the IGBT module is equivalent to a magnetic dipole, which proves that the change of DM interference signal will cause the change of EMR signal, thus demonstrating the feasibility of using EMR signal to monitor bond wires aging. Finally, a buck converter composed of IGBT module is used as the equipment to be tested. The EMR signal is extracted by the near-field probe, and the EMR signal spectrum is used to monitor the aging degree of the bond wires. The experimental results show that with the deepening of the aging degree of bond wires, the spectrum amplitude of EMR signal increases.

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“…The behavior model of IGBT chip in the stage of rapid current decline can be equivalent to a time-varying current source with parasitic capacitance [7,15], as shown in Fig. 3.…”

Section: Root Reasons Of Dm Interferencementioning

confidence: 99%

Aging Monitoring of Bond Wires Based on Emr Signal Spectrum Characteristics for Igbt Module

Ren¹,

Du²,

Yin³

et al. 2022

PIER

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show abstract

“…During the turn off process, after time t6, the gate voltage decreases below the threshold voltage Vth, the IGBT chip starts to turn off, and the collector current decreases rapidly until time t7, when the tail current begins to form. During the switching process, the current change rate of the collector depends on the carrier concentration in its internal channel, and the rapid change rate of collect current is shown in formula (1) [11].…”

Section: A Switching Behavior Of Igbt Chipmentioning

confidence: 99%

“…When the radiation interference signal is captured by the near-field coil, the different operation states of the chip can be judged according to the difference of the interference signal. In [11], the EMI sources inside the three-phase inverter are simulated as voltage source and current source respectively, and the common mode (CM) interference and DM interference in the circuit are predicted. In the traditional model, the DM interference and CM interference are independent of each other, but the DM interference affects the CM interference, and the CM interference does not affect the DM interference.…”

Section: Introductionmentioning

confidence: 99%

Aging Monitoring Method of Bond Wires-Based on Phase-Frequency Characteristics of Differential Mode Conducted Interference Signal for IGBT Module

Chu

Dong

et al. 2021

IEEE Trans. Device Mater. Relib.

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This paper presents an on-line monitoring method of IGBT module bond wires aging based on the phase-frequency characteristics (PFCs) of differential mode (DM) interference signal. Firstly, the collector current variation during IGBT chip switching is analyzed, and the relationship between the aging degree of bond wires and the PFCs of DM interference signal is studied; Secondly, a phase angle characteristic measurement system of DM interference signal is built and used to online monitor the aging of bond wires in IGBT module; Finally, taking the buck converter composed of IGBT module as the equipment under tested, the interference signal is extracted by the RF current probe and processed by the low-pass filter and signal amplifier, then the phase angle characteristics are measured by the oscilloscope board to realize the on-line monitoring of the bond wires aging of IGBT module. The experimental results show that compared with buck converter with healthy IGBT module, the phase angle of DM interference signal in Buck Converter with aging IGBT module is reduced. The proposed method does not need expensive equipment such as spectrum analyzer, and only needs to monitor the aging state of bond wires in IGBT module online through oscilloscope board. Besides, the research method in this paper provides an approximate linear monitoring method for bonding wire lift-off.

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“…However, terminated modeling is still implemented for DM modeling [25], [26] where the converter is modeled at the input side. The terminated behavioral modeling can be applied to mixed mode EMI analysis [27], [28]. The three terminal behavior model of the inverter is derived from the detailed model of the system in [28].…”

Section: ) Behavioral Modelingmentioning

confidence: 99%

“…The terminated behavioral modeling can be applied to mixed mode EMI analysis [27], [28]. The three terminal behavior model of the inverter is derived from the detailed model of the system in [28]. Behavioral methods benefit from simplicity, fast derivation and they are independent of the system configurations.…”

Section: ) Behavioral Modelingmentioning

confidence: 99%

Modeling of Conducted Emissions for EMI Analysis of Power Converters: State-of-the-Art Review

2020

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Electromagnetic interference issues are associated with high-speed switching of power converters. EMI modeling is an essential tool to study and control the EMI emission, enabling more efficient solutions. A comprehensive review and comparison of different modeling approaches for conducted emissions are provided in this paper, which can be used as a design guideline for engineers. For a motor drive application, common mode and differential mode conducted emissions are studied, and dominant noise production mechanisms are identified. Moreover, a review of various modeling techniques is presented for the main parasitic components of the system. Finally, time domain and frequency domain analysis approaches are explored along with the equivalent circuits which enable fast prediction of EMI emissions. This paper intends to help the reader develop an organized understanding of conducted emission modeling to assist them with a more efficient and electromagnetically-compatible design. INDEX TERMS Circuit modeling, common mode, conducted emission, differential mode, electromagnetic interference (EMI), motor drive inverters.

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A New EMI Modeling Method for Mixed-Mode Noise Analysis in Three-Phase Inverter System

Cited by 24 publications

References 25 publications

Aging Monitoring of Bond Wires Based on Emr Signal Spectrum Characteristics for Igbt Module

Aging Monitoring of Bond Wires Based on Emr Signal Spectrum Characteristics for Igbt Module

Aging Monitoring Method of Bond Wires-Based on Phase-Frequency Characteristics of Differential Mode Conducted Interference Signal for IGBT Module

Modeling of Conducted Emissions for EMI Analysis of Power Converters: State-of-the-Art Review

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