A new class of capacitive micromachined ultrasonic transducers

Ahrens, O.; Hohlfeld, Dennis; Buhrdorf, A.; Glitza, O.; Binder, J.

doi:10.1109/ultsym.2000.922695

Cited by 5 publications

(2 citation statements)

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“…The CMUT fabrication based on surface micromachining method has been extensively studied since its inception in 1994 [1,[41][42][43][44][45][46][47][48][49][50][51][52][53][54]. A general surface micromachining process is illustrated in Figure 2.…”

Section: Surface Micromachiningmentioning

confidence: 99%

Fabrication of capacitive micromachined ultrasonic transducers based on adhesive wafer bonding technique

Wong

Chen

et al. 2016

J. Micromech. Microeng.

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To my supervisor, Prof. Yeow. Thank you for giving me the opportunity to work in AMNDL. Thank you for supporting all the equipment/materials, and facility accesses. I know how expensive they are and without you, I would not have been able to execute my ideas and finish the projects. To my committees, Prof. Huissoon, Prof. Nieva and Prof. Stashuk, Thank you for all the comments and suggestions on my project. Additionally, I would say thank you to Prof. Huissoon. You gave me the to come to study in Waterloo and I will never forget the time I received your email where you asked me to come to Canada. To Prof. Cretu, thank you for agreeing to be the external committee and travelling to Waterloo for my defence. The CMUTs in this thesis were fabricated in G2N and TNFC. I would say thank Richard,

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Section: Surface Micromachiningmentioning

confidence: 99%

Fabrication of capacitive micromachined ultrasonic transducers based on adhesive wafer bonding technique

Wong

Chen

et al. 2016

J. Micromech. Microeng.

View full text Add to dashboard Cite

show abstract

“…However, this design requires shorter channels and minimal tolerance to alignment. Consequently, the channels do not seal as quickly, and silicon nitride deposition inside the LPCVD deposited low-temperature silicon dioxide (LTO) is an alternative to silicon nitride to seal the etch holes ( [38], [39], [85]). Because LPCVD LTO has a higher sticking coefficient than silicon nitride, it is possible to seal the etch holes without long etch channels, (provided the etch hole is sufficiently wide) and to improve the active area coverage, even for small membranes.…”

Section: Membrane Sealingmentioning

confidence: 99%