A New Approach to Boundary Condition Independent Compact Dynamic Thermal Models

Augustin, A.; Hauck, T.

doi:10.1109/stherm.2007.352428

Cited by 4 publications

(3 citation statements)

References 13 publications

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“…However, this is possible just for drastically simplified situations [9]. The third group of solutions relies on the mathematical theory of model order reduction in which the system of equations, obtained by FEM, is projected into lower dimensional spaces, using various projecting techniques, before being solved [10][11][12][13]. This class of methods relies on a full FEM simulation for each specific structure and design, requiring, therefore, modeling expertise by the end user and computationally expensive preprocessing operations.…”

Section: Introductionmentioning

confidence: 99%

Convolution based compact thermal model application to the evaluation of the thermal impact of die to die interface including interconnections

Maggioni

Oprins

Beyne

et al. 2014

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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Thermal aware design of integrated circuits is essential to avoid reliability issues and failures especially in 3D-technology where active dies are placed on top of each other and more heat is dissipated on the same area available for cooling compared to conventional 2D-packages. A certain number of parameters can be selected to reduce temperature and temperature gradient. This paper is mainly focusing on the thermal impact of the dieto-die interface layer. This consists of adhesive material and arrays of interconnection structures. Besides being used for electrical die-die connections, they can be added to locally improve the low thermal conductivity of the adhesive. Short computational time is preferred for the thermal analysis of different designs: this is why various compact thermal models (CTMs) strategies have been developed. The one presented here, for the steady state temperature evaluation of two dies stacks, is based on convolution and fast Fourier transform. A novel correction methodology is introduced to deal with the material non-homogeneity in the interface layer. Case analyses, as the interface material thermal impact or the maximum achieved temperature as a function of the amount of interconnections, are presented in the paper and can be quickly and easily performed with this CTM.

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Section: Introductionmentioning

confidence: 99%

Convolution based compact thermal model application to the evaluation of the thermal impact of die to die interface including interconnections

Maggioni

Oprins

Beyne

et al. 2014

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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“…Temperature measurement is difficult for these layers and therefore direct determination of the thermal parameters within the module is impractical. To overcome these challenges, Finite Element models of power devices are developed within commercially available software programs such as ANSYS [9,[34][35] and FLOTHERM [28] to define accurate thermal profile. However, estimation of the dynamic temperature characteristic of the power modules with several chips is challenging because of the thermal coupling effects among the internal layers during operation [9].…”

Section: Introductionmentioning

confidence: 99%

3D thermal model of power electronic conversion systems for wind energy applications

Batunlu

Musallam

2014

IEEE Global Humanitarian Technology Conference (GHTC 2014)

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Energy is vital for continual progress of human civilization. Accessing to low-cost, environmental friendly, renewable energy sources are keys to economic future for developing countries and around the globe. Wind energy systems are one of the most adequate option where power electronic converters are used for monitoring and conditioning the energy flow; however operating environmental conditions such as variable wind speed cause temperature fluctuations that derive degradation and failures in these systems. Therefore, proper thermal management and control are necessary to monitor their reliability and lifecycle. Besides, power capacity of these devices is being increased by new technological improvements such as multichip designs. Meanwhile, the heat path through the devices has also become more complex due to the heat coupling effect among several chips and it is not possible to be estimated by conventional methods found in literature. In this paper, a three dimensional finite element model (FEM) is implemented for accurate estimation of thermal profile of a power module. Based on the thermal characteristic obtained by the FEM, an electro thermal model was developed to predict the temperatures of each layer of the power module that cannot be measured during service. The work is essential as it solves massive heat transfer issues and it is important to provide health management of power electronics embedded in wind systems. Keywords-Insulated gate bipolar transistor (IGBT); two level converter; electro thermal model; junction temperature; 3D FEM.

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“…The second group consists in the search of analytical solutions for the heat transfer equation in case of really simple geometric structures [9]. A third kind of approach relies on the mathematical techniques of model order reduction that consist in projecting the FE models over lower dimensional spaces exploiting various subspace projection methods [10][11][12][13]. The last group is based on the Green's function theory of solving partial differential equations [14][15][16][17][18].…”

Section: Introductionmentioning

confidence: 99%

Convolution based compact thermal model for 3D-ICs: Methodology and accuracy analysis

Maggioni

Oprins

Beyne

et al. 2013

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

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Thermal analysis is essential in 3D-IC technology due to the reduced footprint and higher power densities compared to conventional 2D packaging [1]. Compact thermal models (CTM) are being developed for fast evaluation of the thermal distribution in the 3D packages. The CTM discussed in this paper is based on the Green's function theory and exploits convolution and fast Fourier transform to compute the temperature profiles starting from matrices storing the power dissipation densities (power maps) and the temperature responses to hot spots. Detailed accuracy assessments are presented for the grid size and for the number of images to be considered for an accurate modelling of the lateral insulating boundary conditions. A two dies stack case study is also analysed showing good agreement with the finite element model results (error less than 0.5%). Finally, the algorithm computational time is discussed indicating a behaviour where N is the number of elements in the matrices.

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A New Approach to Boundary Condition Independent Compact Dynamic Thermal Models

Cited by 4 publications

References 13 publications

Convolution based compact thermal model application to the evaluation of the thermal impact of die to die interface including interconnections

Convolution based compact thermal model application to the evaluation of the thermal impact of die to die interface including interconnections

3D thermal model of power electronic conversion systems for wind energy applications

Convolution based compact thermal model for 3D-ICs: Methodology and accuracy analysis

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