A natively flexible 32-bit Arm microprocessor

Biggs, John; Myers, James; Kufel, Jedrzej; Özer, Emre; Craske, Simon; Sou, Antony; Ramsdale, Catherine; Williamson, Ken; Price, Richard; White, Scott

doi:10.1038/s41586-021-03625-w

Cited by 178 publications

(123 citation statements)

References 17 publications

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“…In the case of metal oxide‐based thin film transistors, a negative shift in threshold voltage is observed under the negative bias stress due to the interaction of the back‐channel surface with moisture and/or traps. [ 2 ] In the current MOSFET, the constant negative bias on the gate terminal tends to deplete the free electrons from the channel at the channel/dielectric interface. Thereby, the number of electrons near the channel/dielectric interface region is decreased.…”

Section: Resultsmentioning

confidence: 99%

“…It is to an arduous task to realize the large area electronics with silicon technology alone and it is challenging to attain the high performance and low data latency with printed electronics alone. [2][3][4][5] Nonetheless, the latter has opened the "resource-efficient" and potentially greener routes for obtaining electronics on diverse substrates. [6] Therefore, putting together the devices contact based printing methods such as offset lithography, gravure printing and flexography, [4] the presented approach does not involve direct contacts between the printing tool and the substrate.…”

Section: Introductionmentioning

confidence: 99%

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Ultra‐Thin Chips with Printed Interconnects on Flexible Foils

Kumaresan

Dahiya

et al. 2021

Adv Elect Materials

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“Heterogeneous Integration” is a promising approach for high‐performance hybrid flexible electronics that combine printed electronics and silicon technology. Despite significant progresses made by integrating rigid silicon chips on flexible substrates, the integration of flexible ultra‐thin chips (UTCs) on flexible foils remains a challenge as they are too fragile for conventional bonding methods. Reliable interconnects (low‐resistivity and mechanical robustness) and bonding of UTCs are critical to the realization of hybrid flexible systems. Herein, using a non‐contact printing approach, an easy and cost‐effective method for accessing UTCs on flexible foils is demonstrated. The high‐viscosity conductive paste, extruded from a high‐resolution printer (1–10 µm line width), is used here to connect the metal oxide semiconductor field effect transistors (MOSFETs) on UTCs with the extended pads on flexible printed circuit boards (PCBs). The electrical characterization of MOSFETs, before and after printing the interconnects, reveals an acceptable level of variation in device mobility (change from 780 to 630 cm2 V−1s−1). This is due to the drop in effective drain bias voltage as a marginally small electrical resistance (≈30 Ω) is added by the printed interconnects. The bonded UTCs show robust device performance under bending conditions, indicating high reliability of both the chip thinning and bonding methods.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Ultra‐Thin Chips with Printed Interconnects on Flexible Foils

Kumaresan

Dahiya

et al. 2021

Adv Elect Materials

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“…These include: haptic motor and driver technology to deliver high-fidelity stimulation with low power usage; battery technology, to increase the potential power usage and reduce the necessity for frequent charging; manufacturing techniques, such as 3D printing, to facilitate the development of comfortable, aesthetically acceptable, and easy to self-fit devices; wireless technologies, to allow audio streaming from remote microphones and other devices and to link processing across multiple stimulation points on the body; and microprocessors to allow advanced signal-processing. Future devices might also take advantage of flexible microprocessor technology, which is currently being developed (Biggs et al, 2021). This could allow additional signal-processing capacity to be built into device components that need to be flexible, such as straps.…”

Section: Important Cutting-edge Technologiesmentioning

confidence: 99%

Can Haptic Stimulation Enhance Music Perception in Hearing-Impaired Listeners?

Fletcher

2021

Front. Neurosci.

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Cochlear implants (CIs) have been remarkably successful at restoring hearing in severely-to-profoundly hearing-impaired individuals. However, users often struggle to deconstruct complex auditory scenes with multiple simultaneous sounds, which can result in reduced music enjoyment and impaired speech understanding in background noise. Hearing aid users often have similar issues, though these are typically less acute. Several recent studies have shown that haptic stimulation can enhance CI listening by giving access to sound features that are poorly transmitted through the electrical CI signal. This “electro-haptic stimulation” improves melody recognition and pitch discrimination, as well as speech-in-noise performance and sound localization. The success of this approach suggests it could also enhance auditory perception in hearing-aid users and other hearing-impaired listeners. This review focuses on the use of haptic stimulation to enhance music perception in hearing-impaired listeners. Music is prevalent throughout everyday life, being critical to media such as film and video games, and often being central to events such as weddings and funerals. It represents the biggest challenge for signal processing, as it is typically an extremely complex acoustic signal, containing multiple simultaneous harmonic and inharmonic sounds. Signal-processing approaches developed for enhancing music perception could therefore have significant utility for other key issues faced by hearing-impaired listeners, such as understanding speech in noisy environments. This review first discusses the limits of music perception in hearing-impaired listeners and the limits of the tactile system. It then discusses the evidence around integration of audio and haptic stimulation in the brain. Next, the features, suitability, and success of current haptic devices for enhancing music perception are reviewed, as well as the signal-processing approaches that could be deployed in future haptic devices. Finally, the cutting-edge technologies that could be exploited for enhancing music perception with haptics are discussed. These include the latest micro motor and driver technology, low-power wireless technology, machine learning, big data, and cloud computing. New approaches for enhancing music perception in hearing-impaired listeners could substantially improve quality of life. Furthermore, effective haptic techniques for providing complex sound information could offer a non-invasive, affordable means for enhancing listening more broadly in hearing-impaired individuals.

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“…NSPIRED by human skin, the smart sensors and electronic skin (e-Skins) are being explored for advancements in applications such as human-machine interaction, robotics, interactive vehicles, and wearables systems for health monitoring [1][2][3][4][5][6][7]. In this regard, various sensing systems have been widely studied using capacitive, piezoelectric, triboelectric, piezoresistive, inductive, optical mechanisms, and their combinations [6,[8][9][10][11][12][13][14]. Amongst these, piezoelectric pressure sensors have drawn attention owing to their capability to detect dynamic contact forces [15,16].…”

Section: Introductionmentioning

confidence: 99%

Flexible Tactile Sensors Using AlN and MOSFETs Based Ultra-Thin Chips

Kumaresan

Dahiya

et al. 2023

IEEE Sensors J.

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This paper presents ultrathin chips (UTCs) based flexible tactile sensing system for dynamic contact pressure measurement. The device comprises of an AlN piezocapacitor based UTCs tightly coupled with another UTCs having metaloxide-semiconductor field-effect transistors (MOSFETs). In this arrangement the AlN piezocapacitor forms the extended gate of MOSFETs. Both AlN piezocapacitor and MOSFET based UTCs are obtained by post-process reduction of wafer thicknesses to ~35µm using backside lapping. The performances of both UTCs were evaluated both before and after thinning and there was no noticeable performance degradation. The UTC-based AlN piezocapacitor exhibited six times higher sensitivity (43.79mV/N) than the thin filmbased AlN sensors. When coupled with MOSFETs based UTC, the observed sensitivity was 0.43N -1 . The excellent performance, flexible form factor and compactness shows the potential of presented device in applications such minimal invasive surgical instruments where high-resolution tactile feedback is much needed.

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A natively flexible 32-bit Arm microprocessor

Cited by 178 publications

References 17 publications

Ultra‐Thin Chips with Printed Interconnects on Flexible Foils

Ultra‐Thin Chips with Printed Interconnects on Flexible Foils

Can Haptic Stimulation Enhance Music Perception in Hearing-Impaired Listeners?

Flexible Tactile Sensors Using AlN and MOSFETs Based Ultra-Thin Chips

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