A mould-and-transfer technology for fabricating scanning probe microscopy probes

Zou, Jun; Wang, Xuefeng; Bullen, David; Ryu, Kee Suk; Liu, Chang; Mirkin, Chad A.

doi:10.1088/0960-1317/14/2/006

Cited by 54 publications

(43 citation statements)

References 22 publications

(27 reference statements)

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“…SU-8 has been integrated in a number of micro devices, including microfluid devices, [82] artificial haircell flow sensors [83] (Fig. 4), SPM probes, [84] manipulators, [85] and micro needles for drug delivery. [86] 3.…”

Section: D) Su-8 Epoxymentioning

confidence: 99%

Recent Developments in Polymer MEMS

2007

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Polymer materials, including elastomers, plastics and fibers, are being actively used for MEMS sensors and actuators. Polymer materials provide many advantages in terms of cost, mechanical properties, and ease of processing. In addition, polymers are being investigated for displays, memory, and circuitry. However, the incorporation of polymers for structural or functional purposes in MEMS systems raises new issues and challenges. This article provides a comprehensive review of the recent state of the art of polymer based MEMS—including materials, fabrication processes, and representative devices, including microfluidic valves and tactile sensors. Frequently used materials are reviewed, including polydimethylsiloxane (PDMS), parylene, nanocomposite elastomers, and SU‐8 epoxy.

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Section: D) Su-8 Epoxymentioning

confidence: 99%

Recent Developments in Polymer MEMS

2007

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“…6. Compared to other methods Zou et al 2004;Metz et al 2005;Mouaziz et al 2006), no chemicals are required to release the chips which are simply peeled off the substrate. Furthermore, the lamination of a PET layer on a substrate is faster and more convenient than the deposition of selfassembled monolayers employed in already described dry release techniques (Kim et al 2002;Cheng et al 2004).…”

Section: Release Of Su-8 Components and Residual Stressmentioning

confidence: 99%

Low-stress fabrication of 3D polymer free standing structures using lamination of photosensitive films

et al. 2008

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Free-standing microstructures such as cantilevers, membranes or microchannels are building blocks of microfluidic systems and MEMS. As a complement to silicon, the large family of polymers offers many opportunities for micro and nanotechnologies. Their low temperature processing and the planarizing properties of many resists is a definitive advantage for system integration, paving the way to complete lab-on-chips. In this article, we investigate a fabrication process of polymeric free standing structures based on the lamination of SU-8, a thick epoxy photoresist. Our motivation is the hybrid integration of polymer microfluidic or MEMS components with silicon chips (e.g., integrated circuits or sensors). Compared to rigid substrates used in more conventional SU-8/SU-8 bonding process, the flexible photosensitive films used within this lamination technique allows a more homogeneous and reliable bonding at low pressure and temperature, and a 3D fabrication with an excellent levelto-level alignment. A parametric optimization of the lamination process is presented. The fabrication of a leakage-free 3D microfluidic network is demonstrated by stacking up to five layers. A polyethylene terephtalate layer has been employed to easily release the SU-8 devices. We show that this release layer also significantly decrease the curvature of the substrate by 32% and the related residual stress in a 100 lm SU-8 layer by at least 10%. Finally, we briefly describe the hybrid integration of a silicon sensor in a microfluidic network as a direct application of our lamination process to the fabrication of lab-on-chips.

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“…The release process is usually performed in liquid phase. Thin films of titanium [33], silicon dioxide [28], copper [34,35], chromium [36], and trilayers chromium/gold/chromium [37] were used as sacrificial materials for releasing areas with lateral dimensions smaller than 1 mm. The film material is selected according to the compatibility of the chemical etchant with the other elements, such as electrodes that are to be integrated with the SU-8 component.…”

Section: Release Techniquesmentioning

confidence: 99%

SU‐8 as a structural material for labs‐on‐chips and microelectromechanical systems

et al. 2007

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Since its introduction in the nineties, the negative resist SU-8 has been increasingly used in micro- and nanotechnologies. SU-8 has made the fabrication of high-aspect ratio structures accessible to labs with no high-end facilities such as X-ray lithography systems or deep reactive ion etching systems. These low-cost techniques have been applied not only in the fabrication of metallic parts or molds, but also in numerous other micromachining processes. Its ease of use has made SU-8 to be used in many applications, even when high-aspect ratios are not required. Beyond these pattern transfer applications, SU-8 has been used directly as a structural material for microelectromechanical systems and microfluidics due to its properties such as its excellent chemical resistance or the low Young modulus. In contrast to conventional resists, which are used temporally, SU-8 has been used as a permanent building material to fabricate microcomponents such as cantilevers, membranes, and microchannels. SU-8-based techniques have led to new low-temperature processes suitable for the fabrication of a wide range of objects, from the single component to the complete lab-on-chip. First, this article aims to review the different techniques and provides guidelines to the use of SU-8 as a structural material. Second, practical examples from our respective labs are presented.

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A mould-and-transfer technology for fabricating scanning probe microscopy probes

Cited by 54 publications

References 22 publications

Recent Developments in Polymer MEMS

Recent Developments in Polymer MEMS

Low-stress fabrication of 3D polymer free standing structures using lamination of photosensitive films

SU‐8 as a structural material for labs‐on‐chips and microelectromechanical systems

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