2014
DOI: 10.1016/j.ijheatmasstransfer.2014.07.040
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A molecular dynamics study on heat conduction characteristics inside the alkanethiolate SAM and alkane liquid

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Cited by 38 publications
(18 citation statements)
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“…Therefore, we can estimate that thermal conductivity in the direction of intermolecular chains is ∼100 W/(m·K) if the packing density is 10 19 m –2 and the ballistic phonon mean free path is ∼100 nm, which is consistent with Shen’s result. In fact, self-assembled monolayers (SAMs), in which alkane chains align along the heat flow, exhibit a significantly high thermal conductivity compared to the bulk liquid of the same alkane molecules . These results indicate that depending on the aggregation structure of chains, even polymers without fillers can be sufficiently performant as a TIM.…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, we can estimate that thermal conductivity in the direction of intermolecular chains is ∼100 W/(m·K) if the packing density is 10 19 m –2 and the ballistic phonon mean free path is ∼100 nm, which is consistent with Shen’s result. In fact, self-assembled monolayers (SAMs), in which alkane chains align along the heat flow, exhibit a significantly high thermal conductivity compared to the bulk liquid of the same alkane molecules . These results indicate that depending on the aggregation structure of chains, even polymers without fillers can be sufficiently performant as a TIM.…”
Section: Introductionmentioning
confidence: 99%
“…where R is the total ITR of PBG, R i is the thermal resistance of each sp 3 bond, n is the number of sp 3 bonds formed across the interlayer, and R VDW is the thermal resistance caused by the vdW force. Because the heat-transfer efficiency of covalent interaction is much large than that of vdW force, 37 and the vacancy is much smaller than the overlapping area, the variety of R VDW in PBG with different vacancies is ignored. Here, R VDW was equal to 80.32 Â 10 À9 m 2 KW À1 , which is the ITR of pure bilayer graphene with an overlapping area of 15.451 nm 2 .…”
Section: Influence Of Interlayer Sp 3 Bonds Formed By Adjacent Vacanc...mentioning
confidence: 99%
“…Associated with the miniaturization of integrated electronics, the surface-to-volume ratio of TIM increases, and the interfacial thermal resistance becomes dominant. This fact raised the focus on the application of surface modification and surfactant additives to decrease the thermal resistance at the TIM–substrate contact. We focus on the latter in the present study.…”
Section: Introductionmentioning
confidence: 99%
“…The mechanism of adsorption is an important factor in selecting these models. Recently several studies confirmed that using thiol-terminated additives to modify Au surface by forming S–Au covalent bonds dramatically improves the Au–organic solvent interfacial heat transfer. ,,,, However, the formation of covalent bonds between the solid and adsorbent makes it hard to repair the adsorption film if damaged. Another possibility is hydrogen bonding, which is weaker than a S–Au chemical bond.…”
Section: Introductionmentioning
confidence: 99%