A micromachined piezoresistive angular rate sensor with a composite beam structure

Towards a biomimetic gyroscope inspired by the fly's haltere using microelectromechanical systems technology

“…Hence, besides the responsivity of the sensor, the noise level of the system determines the fundamental detection threshold of the system. To find the detection threshold of our system, we assume a power spectral density Maenaka et al [28] Tang et al [29] Nalbach [23] Li et al [30] Luo et al [31] Xie and Fedder [13] Acar and Shkel [32] Alper and Akin [14] Zaman et al [33] Degawa et al [34] Trusov et al [15] Prikhodko et al [39] Yan et al [35] Walther et al [36] Droogendijk et al [37] this work Figure 3. given by Johnson -Nyquist (thermal) white noise [40]:…”

MEMS Gyroscopes for Consumers and Industrial Applications

“…Beam actuation is provided by a piezoelectric element; the Coriolis-induced vibration is electrostatically detected by measuring the capacitance changes between the beam and dedicated sensing electrodes. A combined beam-mass structure with a composite beam is proposed in (Li et al, 1999). The two-section composite beam structure is designed to have a vertical and a lateral highly compliant vibrating modes.…”

“…quartz, ceramics, special alloys or piezoelectric polymers) to change their shape when subjected to an electric field is effectively exploited to generate a mechanical deformation or displacement. With regards to sensing, either the direct piezoelectric effect (Kotru et al, 2008;Soderkvist, 1991) (generation of an electric field in response to a mechanical strain) or the piezoresistive effect (Li et al, 1999;Voss et al, 1997) (change of electrical resistance in response to a mechanical stress) are effectively used to sense the Coriolis-induced motion.…”

Microfabrication by mask-maskless wet anisotropic etching for realization of multilevel structures in {100} oriented Si

“…first introduced so-called maskmaskless etching [2] for formation of multilevel structures on Si substrates. Latter on, they applied masked-maskless wet anisotropic etching during microfabrication of MEM devices, namely: piezoresistive pressure [3] and piezoresistive angular rate [4] sensors.…”