Proceedings of 2010 IEEE International Symposium on Circuits and Systems 2010
DOI: 10.1109/iscas.2010.5537914
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A MEMS-based temperature-compensated vacuum sensor for low-power monolithic integration

Abstract: This paper presents a MEMS resonator-based vacuum sensor with a low-power transimpedance amplifier and a mixer-based frequency-to-digital converter. The MEMS resonator is fabricated in a CMOS-compatible process, and a 130 nm CMOS technology is used to design the integrated circuitry. The vacuum sensor operates in the pressure range from 10 to 1200 mbar with a resolution of ~2 mbar. The system is temperature-compensated between -10°C and 60°C. The simulated power consumption of the entire system is less than 49… Show more

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Cited by 4 publications
(1 citation statement)
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“…The protective lid serves to prevent microsystems-based components from harmful environmental factors, but also to establish optimal conditions for their functioning. For example, MEMS resonators exhibit very high Q-factor when operated in a vacuum [15]. Moreover, the package has also to ensure the redistribution of the electrical signals between the RF-MEMS device and the external world.…”
Section: Introductionmentioning
confidence: 99%
“…The protective lid serves to prevent microsystems-based components from harmful environmental factors, but also to establish optimal conditions for their functioning. For example, MEMS resonators exhibit very high Q-factor when operated in a vacuum [15]. Moreover, the package has also to ensure the redistribution of the electrical signals between the RF-MEMS device and the external world.…”
Section: Introductionmentioning
confidence: 99%