A melt-processable semicrystalline polyimide structural adhesive based on 1,3-bis(4-aminophenoxy) benzene and 3,3',4,4'-biphenyltetracarboxylic dianhydride

Ratta, Varun; Stancik, Edward J.; Ayambem, A.; Pavatareddy, Hari; McGrath, James E.; Wilkes, Garth L.

doi:10.1016/s0032-3861(98)00399-1

Cited by 34 publications

(29 citation statements)

References 18 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The presence of micro-roughness has been advocated for attaining better bonds and much of these arguments are based on the increased mechanical interlocking that this micro-roughness may provide (23,24). Ratta et al (10) evaluated three kinds of surface treatment namely grit blasting, chromic acid anodization and sodium hydroxide etch, and found out that macro-roughness provided by grit blasting was sufficient in providing a strong interface. The presence of a suitable and strong interface is often indicated by the mode of failure of the bonded joint.…”

Section: Influence Of Surface Roughness Of the Metal Sheetsmentioning

confidence: 99%

“…Aromatic polyimides exhibit good thermal stability due to the chain stiffness which lead to high values of both glass transition and melting temperature, and have been shown to be promising as high-temperature structural adhesives (7)(8)(9). Polyimides are reaction products of diamines and dianhydrides, and the final properties such as tensile strength, toughness, modulus and upper-use temperature are dependent on the selection of the starting monomers (10). The most common technique to fabricate polyimide adhesives is to use a soluble poly(amic acid) as a precursor.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Synthesis and Characterization of a Novel High-Temperature Structural Adhesive Based on MDA-BAPP-BTDA Co-Polyimide

Yang

et al. 2015

Journal of Macromolecular Science, Part A

View full text Add to dashboard Cite

A series of polyimide(PI) adhesives were synthesized from 2,2'-Bis [4-(4-aminophenoxy)phenyl] propane(BAPP), 4,4'-Diaminodiphenylmethane (MDA) and 3,3',4,4'-Benzophenonetetracarboxylic acid dianhydride (BTDA) via a two-step process. PI adhesives with different BAPP content were characterized in regard to their structure, thermal stability, mechanical properties and adhesive performance. Results showed that these PIs had excellent thermal stability, whose glass transition temperature (Tg) were around 300 C. While, superior dynamic mechanical behavior was observed, and the maximum loss factor declined with the increase of BAPP content. Single-lap shear strength of over 15.58 MPa at room temperature was obtained, and it remained high even at the temperature of 350 C. Factors that could affect bonding strength of these PI adhesives such as molar ratio of the diamine monomers, surface roughness of adherends and curing processes were investigated.

show abstract

Section: Influence Of Surface Roughness Of the Metal Sheetsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Synthesis and Characterization of a Novel High-Temperature Structural Adhesive Based on MDA-BAPP-BTDA Co-Polyimide

Yang

et al. 2015

Journal of Macromolecular Science, Part A

View full text Add to dashboard Cite

show abstract

“…Early versions of aromatic polyimides were usually infusible and insoluble because of their rigid chemical structures and unique interactions among their molecular chains, which resulted in difficulties in melt processing by conventional melt‐injection or melt‐extrusion techniques. In recent years, many researches have reported improvements in the melt processability of aromatic polyimides5–15 by the introduction of flexible linkages into the polymer backbones to reduce the stiffness of the polymer chains or the interactions among polymer chains. However, the improvements in the melt processability of aromatic polyimides have usually resulted in the sacrifice of the thermal stability and mechanical properties at elevated temperatures.…”

Section: Introductionmentioning

confidence: 99%

Preparation and properties of melt‐processable polyimides based on fluorinated aromatic diamines and aromatic dianhydrides

Wang

Fan

Liu

et al. 2007

J of Applied Polymer Sci

View full text Add to dashboard Cite

Two series of melt-processable polyimides were prepared from 4,4 0 -bis(3-amino-5-trifluoromethylphenoxy)biphenyl (m-6FBAB) and 4,4 0 -bis(4-amino-5-trifluoromethylphenoxy) biphenyl (p-6FBAB) with various aromatic dianhydrides. The effects of the chemical structures of the polyimides on their properties, especially the melt processability and organic solubility, were investigated. The experimental results demonstrate that some of the fluorinated aromatic polyimides showed good melt processability at elevated temperatures (250-3608C) with relatively low melt viscosities and could be melt-molded to produce strong and tough polyimide sheets. Meanwhile, the polyimides showed excellent organic solubility in both polar aprotic solvents and common solvents to give stable polyimide solutions with high polymer concentrations and relatively low viscosities. Thus, we prepared high-quality polyimide films by casting the polyimide solutions on glass plates followed by baking at relatively low temperatures. The polyimides derived from m-6FBAB showed better melt processability and solubility than the p-6FBAB based polymers. The melt-processable polyimides showed a good combination of thermal stability and mechanical properties, with decomposition temperatures of 547-5978C, glass-transition temperatures in the range 205-2648C, tensile strengths of 81.3-104.9 MPa, and elongations at break as high as 19.6%.

show abstract

“…The rigid structure of polyimides provides high glass transition temperatures (Tg>300'C) and imparts good mechanical properties. The linearity and stiffness of the cyclic backbone allow for molecular ordering, which also provides solvent resistance [3].…”

Section: Usage Of Polyimides In Mepmentioning

confidence: 99%

Adhesive and mechanical properties of Carbon nanotube filled thermoplastic polyimide films for microelectronics packaging

Saeed

2007

2007 International Conference on Emerging Technologies

View full text Add to dashboard Cite

In this study the mechanical and adhesive properties of Multi-walled Carbon Nanotubes (MWNTs) filled polyimide composite films (MWNT-PI) are investigated to determine their usefulness as thermo-conductive packaging materials in microelectronics. MWNTs were mixed in low wt% during synthesis at poly(amic acid) (PAA) stage. MWNT-PI films were characterized using DMTA and tensile testing to determine viscoelastic behavior and mechanical properties. Adhesive strength and adhesive energy of bonded samples were determined in accordance with ASTM D 1002 and ASTM D 3762 respectively. The fractured surfaces were examined by scanning electron microscope (SEM) to determine failure patterns. The results showed that viscoelastic behavior of MWNT-PI films changes from liquidlike to solid-like with increasing MWNT wt content. Elastic modulus and strength at break of the composite films were found to increase with increase in MWNTs wt 00. However, elongation at break and breaking energy of films and lap shear strength and adhesive energy of bonded samples were found to initially increase with increase in MWNTs wt 00, but then after a critical value decreases.

show abstract

A melt-processable semicrystalline polyimide structural adhesive based on 1,3-bis(4-aminophenoxy) benzene and 3,3',4,4'-biphenyltetracarboxylic dianhydride

Cited by 34 publications

References 18 publications

Synthesis and Characterization of a Novel High-Temperature Structural Adhesive Based on MDA-BAPP-BTDA Co-Polyimide

Synthesis and Characterization of a Novel High-Temperature Structural Adhesive Based on MDA-BAPP-BTDA Co-Polyimide

Preparation and properties of melt‐processable polyimides based on fluorinated aromatic diamines and aromatic dianhydrides

Adhesive and mechanical properties of Carbon nanotube filled thermoplastic polyimide films for microelectronics packaging

Contact Info

Product

Resources

About