A macroscopic mechanical model of the wire sawing process

Wire sawing technology: A state-of-the-art review

“…5 shows the variation in silicon wafer thickness due to the dynamically varying material removal rate. Liedke and Kuna [16] presented an analytical model for the macroscopic mechanical conditions in the MWSS process. Based on sawing experimental results, the parametric model is able to analyze the influence of important process parameters such as wire velocity, feed velocity, and wire tension and geometric parameters such as ingot size and wire length, on the lapping pressure and wire bow.…”

Discrete element simulation of micromechanical removal processes during wire sawing

“…The exact shape of the bow depends on certain machining parameters like wire speed, feed speed and the wire tension as well as the properties of the slurry. A macroscopic mechanical model, which describes the temporal development of this wire deflection and the cutting forces during the sawing process, is presented by Liedke and Kuna [26]. Therein, the system ingot-slurry-wire is decomposed into two parts, the wire and the ingot.…”

Formulation and Implementation of Energy Efficient Ultraviolet Curing for Photosensitive Resin-Bound Diamond Wire Saws

“…The main composition materials for the manufacture of the new diamond wire saw are photosensitive resin, core wire, and abrasive [12][13][14][15][16][17][18][19][20][21][22][23]. The photosensitive resin plays a vital role in the performance of the diamond wire saw.…”