2009
DOI: 10.1109/led.2009.2024013
|View full text |Cite
|
Sign up to set email alerts
|

A Low-Voltage Lateral SJ-FINFET With Deep-Trench p-Drift Region

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1

Citation Types

1
9
0

Year Published

2012
2012
2024
2024

Publication Types

Select...
5
2

Relationship

0
7

Authors

Journals

citations
Cited by 25 publications
(10 citation statements)
references
References 7 publications
1
9
0
Order By: Relevance
“…We have carefully examined trench depths ranging from 1.5 µm -3.0 µm in a step of 0.3 µm. We have observed that the difference in the doping concentration of the SJ n-and p-pillars becomes smaller as the trench depth is increased, also reported by [7]. For effective pathway to the SJ drift region, a trench depth of 2.7 µm (W side ) is chosen in this study.…”
Section: Device Structure Of Sj-mgfetsupporting
confidence: 56%
See 2 more Smart Citations
“…We have carefully examined trench depths ranging from 1.5 µm -3.0 µm in a step of 0.3 µm. We have observed that the difference in the doping concentration of the SJ n-and p-pillars becomes smaller as the trench depth is increased, also reported by [7]. For effective pathway to the SJ drift region, a trench depth of 2.7 µm (W side ) is chosen in this study.…”
Section: Device Structure Of Sj-mgfetsupporting
confidence: 56%
“…8 (b) illustrates the specific on-resistance profile along A-A cut-line of the SJ-MGFET under the charge balance condition with W side = 2.7 µm, and L drif t = 3.5 µm. In comparison with conventional SJ-LDMOSFET technology at the same voltage rating and channel length, the SJ-MGFET offers R on,sp of 8.9 µΩ.cm 2 and 0.204 mΩ.cm 2 at both channel and drift regions respectively; corresponding to 88% and 56% reduction [7]. Fig.…”
Section: Structure Optimisation Of Sj-mgfetmentioning
confidence: 97%
See 1 more Smart Citation
“…The cost down and tradeoff between breakdown voltage and on-resistance have always been major concerns. Many studies have proposed that their structures only need few masks [2][3][4][5]. However, they are still special processes, and need wire bonding to connect with main circuit.…”
Section: Introductionmentioning
confidence: 99%
“…Trench fabrication technology has grown over the years from a small scale venture to a large scale commercial enterprise with huge investments running into billion of dollars[99]. The trench gate MOSFET has been utilised for a wide-range of applications in the semiconductor technology such as the lateral trench MOSFETs and power integrated circuits[100], the trench IGBTs[101,102], and the trench SJ MOSFETs[103][104][105][106].The SJ concept has been employed to achieve a high BV and a low specific onresistance. However, the implementation of the lateral SJ transistor technology for low voltage (< 200 V) applications has not been attractive due to the fact that the channel resistance becomes comparable to the drift resistance at a low voltage ratings.…”
mentioning
confidence: 99%