Silicon RFIC technology has become dominant for mobile and wireless applications in the low gigahertz range, and with heterojunction devices, the circuits are moving into the millimeter‐wave range. This article provides a summary of the technology, design, and application of RFICs.
The article includes sections on devices, passive components, CAD, amplifier design, oscillators, mixers, filters, and transceivers. It presents an overview of each topic, to give an up‐to‐date background in each topic.
A substantial part of the article is on modern aspects such as realizing high‐
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inductors, high‐efficiency power amplifiers, frequency synthesis, and direct conversion transceivers architectures. It finishes by describing the importance of considering the package integration as an important part of the design and the system‐in‐package concept.