Radio‐Frequency Integrated Circuits

Abstract

Silicon RFIC technology has become dominant for mobile and wireless applications in the low gigahertz range, and with heterojunction devices, the circuits are moving into the millimeter‐wave range. This article provides a summary of the technology, design, and application of RFICs. The article includes sections on devices, passive components, CAD, amplifier design, oscillators, mixers, filters, and transceivers. It presents an overview of each topic, to give an up‐to‐date background in each topic. A substantial part of the article is on modern aspects such as realizing high‐ Q inductors, high‐efficiency power amplifiers, frequency synthesis, and direct conversion transceivers architectures. It finishes by describing the importance of considering the package integration as an important part of the design and the system‐in‐package concept.

Optimizing MMIC performance: The synergy of AI models and heterogeneous integration process

“…Monolithic microwave integrated circuit (MMIC) technology plays a pivotal role in the design and manufacture of high‐frequency, high‐performance radio frequency (RF), and microwave circuits 1 . Fabricated on semiconductor substrates, such as Si, GaAs, and InP, 2 MMICs integrate various microwave and RF circuit components, including amplifiers, mixers, oscillators, 3 switches, filters, and antennas, 4 onto a single chip 5 . Their integrated design features make MMICs compact, high‐performing, wide‐band, and reliable, thereby serving critical roles in numerous applications, including wireless communication, radar, satellite, millimeter‐wave technology, radio frequency identification (RFID), and medical diagnostic equipment 6 …”