2021
DOI: 10.1088/1361-6641/abf3a9
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A latch-up-free LVTSCR with improved overshoot characteristic for ESD protection in 40 nm CMOS process

Abstract: In this paper, a novel robust low-voltage-triggered silicon-controlled rectifier (LVTSCR) with high holding voltage, low trigger voltage, and low overshoot voltage has been proposed for 5 V integrated circuit electrostatic discharge (ESD) protection. The new LVTSCR integrates an extra low-resistance current path by embedding an NMOS transistor into the traditional LVTSCR. This extra current path will divert part of the ESD current, thus resulting in a lower overshoot voltage as well as better quasi-static I–V … Show more

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Cited by 3 publications
(3 citation statements)
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“…Major electric vehicle manufacturers have adopted SiC inverters to reduce vehicle weight and enhance energy efficiency. 1 GaN has been successfully utilized for fast chargers and in 5G communication technologies as a high-power amplifier. 2,3 In comparison with WBG materials, b-Ga 2 O 3 , a UWBG material, has a larger bandgap range (4.7-4.9 eV) and theoretically higher breakdown fields (B8 MV cm À1 ).…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…Major electric vehicle manufacturers have adopted SiC inverters to reduce vehicle weight and enhance energy efficiency. 1 GaN has been successfully utilized for fast chargers and in 5G communication technologies as a high-power amplifier. 2,3 In comparison with WBG materials, b-Ga 2 O 3 , a UWBG material, has a larger bandgap range (4.7-4.9 eV) and theoretically higher breakdown fields (B8 MV cm À1 ).…”
Section: Introductionmentioning
confidence: 99%
“…2,3 In comparison with WBG materials, b-Ga 2 O 3 , a UWBG material, has a larger bandgap range (4.7-4.9 eV) and theoretically higher breakdown fields (B8 MV cm À1 ). 4 b-Ga 2 O 3 exhibits an exceptionally high Baliga's figure-of-merit (BV 2 /R ON )-which is the performance indicator related to conduction loss-which is equal to 3214, surpassing those of Si (1), SiC (317), and GaN (846). 5 Using the edge-defined film-fed growth method, it is possible to produce large-area substrates for commercial purposes (4 in) and research applications (6 in).…”
Section: Introductionmentioning
confidence: 99%
“…However, the disadvantages are that the SCR trigger voltage is too high, the deep snapback brings low holding voltage and the opening speed is slow. To improve the performance of the SCR, the modified lateral SCR (Liang et al , 2015; Du et al , 2019) and the low-voltage triggering SCR (Chen et al , 2021; Chang et al , 2021) were invented to reduce the trigger voltage of the SCR devices. Moreover, some advanced circuit techniques have also been applied to enhance the turn-on efficiency of ESD protection circuits with SCR devices, such as the gate-coupled technique (Wei et al , 2021) and the GGNMOS-triggered SCR (Zhang et al , 2015).…”
Section: Introductionmentioning
confidence: 99%