Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical
DOI: 10.1109/memsys.2002.984344
|View full text |Cite
|
Sign up to set email alerts
|

A large stepwise motion electrostatic actuator for a wireless microrobot

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

0
12
0

Publication Types

Select...
4
2
1

Relationship

0
7

Authors

Journals

citations
Cited by 23 publications
(13 citation statements)
references
References 3 publications
0
12
0
Order By: Relevance
“…The large capacitance of the tested DMMS induces a maximum operating frequency of 20 Hz. According to the finite element method (FEM) results of the actuator's x displacement [26], such a DMMS-based microrobot supporting a load of 2.5 µN is expected to move at a speed of 4.8/3 µm·s…”
Section: Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…The large capacitance of the tested DMMS induces a maximum operating frequency of 20 Hz. According to the finite element method (FEM) results of the actuator's x displacement [26], such a DMMS-based microrobot supporting a load of 2.5 µN is expected to move at a speed of 4.8/3 µm·s…”
Section: Discussionmentioning
confidence: 99%
“…They correspond to the motion system of the microrobot. These DMMS are made of modified inverted scratch drive actuators (SDA) [24], [26]. This section presents the principle of the actuator and its fabrication process.…”
Section: Dmmsmentioning
confidence: 99%
“…Past systems have delivered power through vibration [12], through photothermal transduction [2], [3], through inductive coupling [4], and electrically through gold bonding wire [6], [7], [9]. The capacitively coupled electrostatic power delivery mechanism that we described in [1] is well-suited to the untethered devices presented in the current paper.…”
Section: Introductionmentioning
confidence: 93%
“…Past systems have delivered power through vibration [14], photo-thermal transduction [1], inductive coupling [2], and electrically through gold bonding wire [3]. The capacitively-coupled electrostatic power delivery mechanism that we described in [6,7] is well-suited to the untethered devices presented in the current paper.…”
Section: Related Workmentioning
confidence: 83%
“…While these active components often include thin-film MEMS actuators, the chassis is a macro-scale part such as, for example, a silicon die. For this reason, these micro-robots are often referred to as "walking chips" [1][2][3][4][5].…”
Section: Introductionmentioning
confidence: 99%