A Large-signal Equivalent Circuit for Depletion-type Silicon Ring Modulators

Kim, Minkyu; Shin, Myungjin; Kim, Min-Hyeong; Yu, Byung-Min; Mai, Christian; Lischke, Stefan; Zimmermann, Lars; Choi, Woo-Young

doi:10.1364/ofc.2018.th2a.13

Cited by 8 publications

(4 citation statements)

References 7 publications

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“…However, we find there are still certain problems in practice with Verilog-A modeling, such as the simulation process being prone to non-convergence and the inability to describe complex signals [138]. The SPICE models can also be used to describe the physical properties of photonic devices [139,205,208,209]. It is shown that the description of the physical properties of a specific photonic device can be achieved through a simple RLC network, resulting in high simulation efficiency.…”

Section: Statusmentioning

confidence: 99%

Co-packaged optics (CPO): status, challenges, and solutions

Tan

Liu³

et al. 2023

Front. Optoelectron.

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Due to the rise of 5G, IoT, AI, and high-performance computing applications, datacenter traffic has grown at a compound annual growth rate of nearly 30%. Furthermore, nearly three-fourths of the datacenter traffic resides within datacenters. The conventional pluggable optics increases at a much slower rate than that of datacenter traffic. The gap between application requirements and the capability of conventional pluggable optics keeps increasing, a trend that is unsustainable. Co-packaged optics (CPO) is a disruptive approach to increasing the interconnecting bandwidth density and energy efficiency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics. CPO is widely regarded as a promising solution for future datacenter interconnections, and silicon platform is the most promising platform for large-scale integration. Leading international companies (e.g., Intel, Broadcom and IBM) have heavily investigated in CPO technology, an inter-disciplinary research field that involves photonic devices, integrated circuits design, packaging, photonic device modeling, electronic-photonic co-simulation, applications, and standardization. This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform, identify the key challenges, and point out the potential solutions, hoping to encourage collaboration between different research fields to accelerate the development of CPO technology. Graphical Abstract

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Section: Statusmentioning

confidence: 99%

Co-packaged optics (CPO): status, challenges, and solutions

Tan

Liu³

et al. 2023

Front. Optoelectron.

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“…Here we assume the effectiveindex variation of the Si waveguide is a linear function of a small signal applied on the p-n junction. According to the coupledmode theory [13] of a microcavity, the transfer function of EO conversion for the Si MRM in the s-domain can be expressed by [20], [21], [22].…”

Section: Electrical-to-optical Conversion Of a Silicon Microring Modu...mentioning

confidence: 99%

Study of Electrical and Optical Peaking of Si Ring Modulators for Tailoring Modulation Band

2023

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An operation scheme using electrical peaking and optical peaking to engineer the modulation band of a Si microring modulator is presented. By incorporating an inductor design at the metal traces of a Si microring modulator, the driving signal can be magnified near the peaking frequency. Although adjusting the wavelength detuning of a ring modulator also introduces optical peaking to extend the 3-dB roll-off frequency, using inductive peaking has no detrimental effect on the low-frequency response. By exploiting both effects, the modulation band can be tailored with more degrees of freedom. We accomplish a Si microring modulator design with a wide and flat transmission band over 95 GHz, which is potentially applied for a non-return-to-zero (NRZ) data transmission over 120 Gbit/s without extra signal post-compensation.

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“…Model extractions, especially for RF applications, play an important role in optimizing circuits [103]. The equivalent [96] circuit modeling is presented in [104] that combines the genetic algorithm (GA) [105] with Powell's method to specify circuit elements of the equivalent model.…”

Section: Equivalent Model Extraction and Parametric Optimizationmentioning

confidence: 99%

Optimization techniques for analog and RF circuit designs: an overview

Kouhalvandi

Ceylan²,

Özoğuz

2020

Analog Integr Circ Sig Process

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Optimizations have gained much consideration from the researchers working in the domains of analog and radio frequency (RF), recently. Dealing with highly nonlinear behavior of active components and aiming to meet design specifications are common issues in all nonlinear circuit designs. As a consequence and accordingly, many studies have been conducted on diverse optimization methods and algorithms for tackling the design problems and meeting optimal solutions with high accuracy. The main purpose of this article is to provide a comprehensive and systematic literature review for the optimization approaches applied by the researchers for designing various analog and microwave circuits. We focus on considering the existing optimization methods from the newly published optimization methods in the last decade. Thus, this study can guide and enlighten complementary metal-oxide-semiconductor analog and RF microwave circuit designers to consider optimization methods commonly used in both areas and to expand conventional performance figures used in their area.

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A Large-signal Equivalent Circuit for Depletion-type Silicon Ring Modulators

Cited by 8 publications

References 7 publications

Co-packaged optics (CPO): status, challenges, and solutions

Co-packaged optics (CPO): status, challenges, and solutions

Study of Electrical and Optical Peaking of Si Ring Modulators for Tailoring Modulation Band

Optimization techniques for analog and RF circuit designs: an overview

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