2021 19th IEEE International New Circuits and Systems Conference (NEWCAS) 2021
DOI: 10.1109/newcas50681.2021.9462788
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A High Speed Fully Integrated Capacitive Digital Isolation System in 0.35 µm CMOS for Industrial Sensor Interfaces

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Cited by 6 publications
(3 citation statements)
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“…Digital isolators with common-mode transient immunity (CMTI) become basic devices in low-power applications. The development of digital isolators is directed towards two directions, reducing cost and optimizing performance [6]. Inductive coupling and capacitive coupling are two common forms of isolation in CMOS-based digital isolators.…”
Section: Introductionmentioning
confidence: 99%
“…Digital isolators with common-mode transient immunity (CMTI) become basic devices in low-power applications. The development of digital isolators is directed towards two directions, reducing cost and optimizing performance [6]. Inductive coupling and capacitive coupling are two common forms of isolation in CMOS-based digital isolators.…”
Section: Introductionmentioning
confidence: 99%
“…Capacitive isolators are implemented in silicon dioxide (SiO 2 ) technology which has a dielectric strength of up to 500 V/µm [8,9]. As a result, an isolation voltage of 1.5 kV rms can be achieved within a 3 µm SiO 2 thickness between metal-1 and metal-6 in a 0.18 µm CMOS process [10].…”
Section: Introductionmentioning
confidence: 99%
“…More work and research were done in these methods. For example, using inductive-coupled to get less power consumption [13], to receive high common-mode transient immunity [14], and using capacitive-coupled to build a high speed fully integrated capacitive digital isolation system [15].…”
Section: Introductionmentioning
confidence: 99%