A High Spectral Efficiency Receiver at 57-66 GHz Using 65-nm CMOS in LTCC Package With Polarization MIMO

Zhong, Jie; Lin, Wen-Jie; Cheng, Jen Hao; Kung, Yi Hsiang; Chen, Jiun Peng; Tsai, Jeng Han; Hsu, Powen; Huang, Tian Wei

doi:10.1109/access.2019.2938845

Cited by 6 publications

(1 citation statement)

References 31 publications

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“…At THz band the shorter wavelength makes possible the development of miniature antennas suitable for integrating with the THz chip. However, implementation of the miniature antennas requires consideration of unwanted parasitic effects that can undermine the system performance, and the uncertainty introduced by wire or flip-chip bonding 5 , as the antenna is directly connected to the integrated circuit.…”

Section: Introductionmentioning

confidence: 99%

High gain/bandwidth off-chip antenna loaded with metamaterial unit-cell impedance matching circuit for sub-terahertz near-field electronic systems

Alibakhshikenari

Virdee

Mariyanayagam

et al. 2022

Sci Rep

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An innovative off-chip antenna (OCA) is presented that exhibits high gain and efficiency performance at the terahertz (THz) band and has a wide operational bandwidth. The proposed OCA is implemented on stacked silicon layers and consists of an open circuit meandering line. It is shown that by loading the antenna with an array of subwavelength circular dielectric slots and terminating it with a metamaterial unit cell, its impedance bandwidth is enhanced by a factor of two and its gain on average by about 4 dB. Unlike conventional antennas, where the energy is dissipated in a resistive load, the technique proposed here significantly reduces losses. The antenna is excited from underneath the antenna by coupling RF energy from an open-circuited feedline through a slot in the ground-plane of the middle substrate layer. The feedline is shielded with another substrate layer which has a ground-plane on its opposite surface to mitigate the influence of the structure on which the antenna is mounted. The antenna has the dimensions 12.3 × 4.5 × 0.905 mm3 and operates across the 0.137–0.158 THz band corresponding to a fractional bandwidth of 14.23%. Over this frequency range the average measured gain and efficiency are 8.6 dBi and 77%, respectively. These characteristics makes the proposed antenna suitable for integration in sub-terahertz near-field electronic systems such as radio frequency identification (RFID) devices with high spatial resolution.

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Section: Introductionmentioning

confidence: 99%

High gain/bandwidth off-chip antenna loaded with metamaterial unit-cell impedance matching circuit for sub-terahertz near-field electronic systems

Alibakhshikenari

Virdee

Mariyanayagam

et al. 2022

Sci Rep

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THz Imaging Technology Trends and Wide Variety of Applications: a Detailed Survey

2023

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A Cost-Effective Antenna-in-Package Design With a 4 × 4 Dual-Polarized High Isolation Patch Array for 5G mmWave Applications

2021

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A cost-effective antenna-in-package design based on a 4 × 4 dual-polarized high isolation patch array for 5G mmWave applications is proposed in this paper. To obtain a cost-effective design, we devised a four-layer metal stack-up structure with dielectric materials consisting of one TLY-5 polytetrafluoroethylene (PTFE) and two FR-4 epoxies. The devised stack-up exhibits a simple and compact geometry due to the small number of layers, which allows the design to be manufactured using a low-priced standard printed-circuit-board process. Additionally, the employed material combination in the stack-up design possesses a high-end PTFE only in the region with the antenna radiators, which enables good antenna radiation performance at an affordable price. In addition, to design a high-isolation patch array for dual-polarized applications using the low-layer stack-up structure, we employed capacitive probes, defected ground structures, and the rotated-fed method in the proposed array design. With these techniques, the designed array exhibited excellent performance with respect to both port-to-port isolation and crosspolarization isolation. The mechanism of improvement in port-to-port isolation was clearly described using the established equivalent circuit model of the proposed structure. As a result, the fabricated antenna-inpackage has the reflection coefficients of less than -10 dB in the targeted frequency range of 26.5-29.5 GHz and has a peak gain of 17.37 dBi at 28 GHz. The measured port-to-port isolations and crosspolarization isolations are higher than 22.63 and 30 dB in the targeted frequency band, respectively.INDEX TERMS 5G mm-Wave, antenna in package (AiP), capacitive probe, defected ground structure (DGS), dual-polarized patch antennas

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A High Spectral Efficiency Receiver at 57-66 GHz Using 65-nm CMOS in LTCC Package With Polarization MIMO

Cited by 6 publications

References 31 publications

High gain/bandwidth off-chip antenna loaded with metamaterial unit-cell impedance matching circuit for sub-terahertz near-field electronic systems

High gain/bandwidth off-chip antenna loaded with metamaterial unit-cell impedance matching circuit for sub-terahertz near-field electronic systems

THz Imaging Technology Trends and Wide Variety of Applications: a Detailed Survey

A Cost-Effective Antenna-in-Package Design With a 4 × 4 Dual-Polarized High Isolation Patch Array for 5G mmWave Applications

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