A High Pressure Sensor with Circular Diaphragm Based on MEMS Technology

Abstract

A pressure sensor in the range of 25 MPa with circular diaphragm is designed and fabricated, and the calibration experiments prove its excellent performance, which also reflects the correct choice of design after analyzing the effect of diaphragm dimension, location and shapes of piezoresistors. Circular diaphragms of different thickness and diameters are simulated to meet the pressure requirement of 25 MPa. It also displays the advantage of piezoresistive sensors over others and the difference characteristics between different types of piezoresistive sensors. And then the effect of piezoresistor location is analyzed and simulated to attain high accuracy and sensitivity after the circular diaphragm chip is packaged with borosilicate glass ring. The whole fabrication process of the chip is inexpensive and compatible with standard MEMS process. The experimental results show the developed high pressure sensor with the sensitivity of 2.533 mV/MPa has excellent performance, such as linearity of 0.08%FS, hysteresis of 0.03%FS, accuracy of 0.11%FS and repeatability of 0.03%FS under high temperature of 200 °C.

Simulation and Nonlinearity Optimization of a High-Pressure Sensor

“…In 2011, Zhao et al designed and fabricated a high-pressure sensor in the range of 25 MPa with a circular diaphragm. They analyzed the effect of diaphragm size, shape, and piezoresistors positions on sensor performance by simulation [ 7 ]. The linearity is 0.08%, and the accuracy is 0.11%.…”

A Study of Temperature Dependence for Capacitive Pressure Sensor

“…Micro pressure sensors have been developed rapidly in the last decades with the development of Micro Electro Mechanical System (MEMS) technology [1]. Recently, a new type Double-notches Touch Mode Capacitive Pressure Sensor (DTMCPS), which is sandwich structure consist of deformation diaphragm Si, insulating layer SiO 2 and double-notches substrate Si as shown in Fig.…”