A high precision SOI MEMS–CMOS ±4g piezoresistive accelerometer

Roy, Anindya; Sarkar, Hrishikesh; Dutta, Anupam; Bhattacharyya, Tarun Kanti

doi:10.1016/j.sna.2014.01.036

Cited by 34 publications

(13 citation statements)

References 30 publications

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“…4 Moreover, the capacitive and piezoresistive acceleration sensors are mainly powered by the traditional power supply unit, which will limit their potential applications. 5 Hence, it is highly desired to fabricate an acceleration sensor with a large output signal and the ability to be self-powered simultaneously.…”

mentioning

confidence: 99%

“…An acceleration sensor is a critical component in vibration monitoring, which acts a pivotal part in many fields such as global position system, biomedical devices, intelligent electronic products, vehicle safety, earthquake monitoring, and mechanical equipment vibration monitoring and troubleshooting. , Usually, the acceleration sensor can be generally classified into piezoelectric, capacitive, and piezoresistive types, among which the piezoelectric sensor is self-powered, while the electric output is very small and could be influenced by the environmental noise . Moreover, the capacitive and piezoresistive acceleration sensors are mainly powered by the traditional power supply unit, which will limit their potential applications . Hence, it is highly desired to fabricate an acceleration sensor with a large output signal and the ability to be self-powered simultaneously.…”

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confidence: 99%

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Self-Powered Acceleration Sensor Based on Liquid Metal Triboelectric Nanogenerator for Vibration Monitoring

Zhang¹,

Zhang²,

Deng³

et al. 2017

ACS Nano

298

183

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An acceleration sensor is an essential component of the vibration measurement, while the passivity and sensitivity are the pivotal features for its application. Here, we report a self-powered and highly sensitive acceleration sensor based on a triboelectric nanogenerator composed of a liquid metal mercury droplet (LMMD) and nanofiber-networked polyvinylidene fluoride (nn-PVDF) film. Due to the ultrahigh surface-to-volume ratio of nn-PVDF film and high surface tension, high mass density, high elastic as well as mechanical robustness of LMMD, the open-circuit voltage and short-circuit current reach up to 15.5 V and 300 nA at the acceleration of 60 m/s, respectively. The acceleration sensor has a wide detection range from 0 to 60 m/s with a high sensitivity of 0.26 V·s/m. Also, the output voltage and current show a negligible decrease over 200,000 cycles, evidently presenting excellent stability. Moreover, a high-speed camera was employed to dynamically capture the motion state of the acceleration sensor for insight into the corresponding work mechanism. Finally, the acceleration sensor was demonstrated to measure the vibration of mechanical equipment and human motion in real time, which has potential applications in equipment vibration monitoring and troubleshooting.

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confidence: 99%

mentioning

confidence: 99%

Self-Powered Acceleration Sensor Based on Liquid Metal Triboelectric Nanogenerator for Vibration Monitoring

Zhang¹,

Zhang²,

Deng³

et al. 2017

ACS Nano

298

183

View full text Add to dashboard Cite

show abstract

“…16 the experimental and theoretical noise floors are in good agreement. Performance of the vibration sensor is compared to other MEMS vibration sensors in Table II [21]- [25]. Note that the noise performance of the sensors reported here were limited by the common interface electronics used for both sensors.…”

Section: Noise Measurementmentioning

confidence: 99%

A High-Performance Piezoelectric Vibration Sensor

2017

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Abstract-We are reporting on the design, fabrication, and characterization of wideband, piezoelectric vibration microsensors. Prototypes were fabricated in a commercial foundry process. The entire thickness of the handle wafer was employed to carve the proof-mass of the device, leading to high sensitivity at a reduced chip area. A thin layer of aluminum nitride was used for sensing the displacements of the proof-mass. A continuous membrane was employed for the device structure in order to push undesired modes to high frequencies. Sensors with different geometries were designed and fabricated. Analytic and finite element analyses were conducted to study device response. A lump element model was developed for the piezoelectric vibration sensor and used for the noise modeling of the complete sensor system. Various performance metrics for the devices were characterized experimentally. Fabricated prototypes exhibited sensitivities as high as 350mV/g with first resonant frequencies of more than 10kHz. These devices are particularly suited for emerging applications in high-frequency vibration sensing.

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“…Mechanical deformation is an important factor affecting the performance of sensors. Some MEMS devices such as gyroscope [3], [4], pressure sensor [5], [6], and accelerometer [7] work on the principle of force conversion. In such cases, these sensors convert the external signals (acceleration, angular velocity, pressure) to electrical signals, and detect the electrical signals to achieve high-precision measurement.…”

Section: Introductionmentioning

confidence: 99%

Thermal Deformation Suppression Chip Based on Material Symmetry Design for Single Center Supported MEMS Devices

Xing

Zhou

Zhang³

et al. 2020

IEEE Access

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Structural thermal deformation is an important factor that affects the performance of MEMS devices. The mismatch of thermal expansion coefficient (CTE) between different materials is a major source. For single center supported MEMS devices, expansion difference between device and the substrate leads to the out of plane thermal deformation of the structure, resulting in the performance deterioration. This paper presents a thermal deformation suppression chip (TDSC) for single center supporting MEMS devices. It is fabricated by the MEMS process and consists of an upper plate and a lower plate. The materials of the upper and lower plates are the same as those of the device substrate and structure respectively. The principle of TDSC to suppress thermal deformation is material symmetry design. Single center anchor is adapted to connect the upper and lower plates. Besides, the center anchor can also isolate the packaging stress generated between TDSC and package shell. In this paper, center supported quadruple mass gyroscope (CSQMG) is used to verify the effect of TDSC. Finite element simulation shows that the thermal deformation suppression effect is determined by radius of TDSC anchor, and the deformation can be suppressed to 0. The conclusion is confirmed by White light interference experiment. In addition, the experiment results also show that the TDSC effectively reduce the thermal out-of-plane deformation after packaging, which is even better than that of the gyroscope without any packaging. It is further proved that TDSC can also significantly improve the temperature performance of the CSQMG. Moreover, the TDSC has simple process steps, small chip area, low cost, and is suitable for various MEMS devices with single center anchor. INDEX TERMS CTE mismatch, single center supported, material symmetry, thermal deformation suppression chip, packaging stress isolation.

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A high precision SOI MEMS–CMOS ±4g piezoresistive accelerometer

Cited by 34 publications

References 30 publications

Self-Powered Acceleration Sensor Based on Liquid Metal Triboelectric Nanogenerator for Vibration Monitoring

Self-Powered Acceleration Sensor Based on Liquid Metal Triboelectric Nanogenerator for Vibration Monitoring

A High-Performance Piezoelectric Vibration Sensor

Thermal Deformation Suppression Chip Based on Material Symmetry Design for Single Center Supported MEMS Devices

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