2008 IEEE MTT-S International Microwave Symposium Digest 2008
DOI: 10.1109/mwsym.2008.4632999
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A general EM-based design procedure for single-layer substrate integrated waveguide interconnects with microstrip transitions

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Cited by 86 publications
(52 citation statements)
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“…In this structure, only TE n0 modes can propagate, and TM modes cannot be guided due to the dielectric gaps created by the via seprations [19].…”
Section: Design Proceduresmentioning
confidence: 99%
“…In this structure, only TE n0 modes can propagate, and TM modes cannot be guided due to the dielectric gaps created by the via seprations [19].…”
Section: Design Proceduresmentioning
confidence: 99%
“…It works in TE or TM modes, instead of the quasi-TEM mode of a microstrip line. Planar transitions such as coplanar waveguides (CPWs) and microstrip lines can be perfectly integrated to SIWs cavities [6][7][8] .…”
Section: Introductionmentioning
confidence: 99%
“…Subsequently, the concept of a new generation of high -frequency integrated circuits called "Substrate Integrated Waveguide circuits (SIW)" [1] has been developed. This new concept has unified the hybrid and monolithic integrations of various planar and non-planar circu its that are made in single substrate and /or multilayer platforms [2]. The SIW technology can greatly facilitate interconnects and integrations between planar and non-planar circuits, which can be made within a patch fabrication process.…”
Section: Introductionmentioning
confidence: 99%