2006 IEEE MTT-S International Microwave Symposium Digest 2006
DOI: 10.1109/mwsym.2006.249731
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A GaN HFET Device Technology on 3" SiC Substrates for Wireless Infrastructure Applications

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Cited by 6 publications
(2 citation statements)
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“…Furthermore, Class-E power amplifier performance (Pout, PAE) can be controlled accurately by applying a programmable dc power supply, thus enabling prime power control while maintaining different levels of radar operational capabilities. GaN HEMTs have shown enormous potential for realizing high power HPAs due to their characteristics of wide bandgap materials such as high breakdown field, high electron saturation velocity and high operating temperature [5][6]. These desirable GaN HEMT properties are critical enabling features for the implementation of advanced class-E HPAs having highly efficient and reliable performance over a broad frequency bandwidth.…”
Section: Introductionmentioning
confidence: 99%
“…Furthermore, Class-E power amplifier performance (Pout, PAE) can be controlled accurately by applying a programmable dc power supply, thus enabling prime power control while maintaining different levels of radar operational capabilities. GaN HEMTs have shown enormous potential for realizing high power HPAs due to their characteristics of wide bandgap materials such as high breakdown field, high electron saturation velocity and high operating temperature [5][6]. These desirable GaN HEMT properties are critical enabling features for the implementation of advanced class-E HPAs having highly efficient and reliable performance over a broad frequency bandwidth.…”
Section: Introductionmentioning
confidence: 99%
“…[5,6,7,8] These results show that GaN is comparable to the incumbent LDMOS technology, however, these operating conditions do not fully leverage the advantages of GaN based devices.…”
Section: Introductionmentioning
confidence: 99%