A fast shaping low power amplifier-comparator integrated circuit for silicon strip detectors

Spencer, E.; Dorfan, D.E.; Grillo, A. A.; Kashigin, S.; Rowe, W.A.; Webster, A.; Wilder, M.

doi:10.1109/23.467788

Cited by 39 publications

(6 citation statements)

References 2 publications

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“…The signal and noise were determined as a function of sensor bias up to 600V. The strip quality of the irradiated sensors was measured by bonding sensors to non-irradiated binary readout chips, the LBIC/CDP [33,34]. These LHC-speed ASICs were used because they were available before the final SCT ABCD3TA had completed development.…”

Section: Contact For Stripsmentioning

confidence: 99%

The silicon microstrip sensors of the ATLAS semiconductor tracker

Ahmad

Albrechtskirchinger

Allport

et al. 2007

Nuclear Instruments and Methods in Physics Research Section A:

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This paper describes the AC-coupled, single-sided, p-in-n silicon microstrip sensors used in the SemiConductor Tracker (SCT) of the ATLAS experiment at the CERN Large Hadron Collider (LHC). The sensor requirements, specifications and designs are discussed, together with the qualification and quality assurance procedures adopted for their production. The measured sensor performance is presented, both initially and after irradiation to the fluence anticipated after 10 years of LHC operation. The sensors are now successfully assembled within the detecting modules of the SCT, and the SCT tracker is completed and integrated within the ATLAS Inner Detector. Hamamatsu Photonics Ltd supplied 92.2% of the 15,392 installed sensors, with the remainder supplied by CiS.

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Section: Contact For Stripsmentioning

confidence: 99%

The silicon microstrip sensors of the ATLAS semiconductor tracker

Ahmad

Albrechtskirchinger

Allport

et al. 2007

Nuclear Instruments and Methods in Physics Research Section A:

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“…CMOS designs were also facilitated by the emergence of semiconductor foundry "brokerages" such as MOSIS, whose multi-project fabrication runs provide a low-cost prototyping path. The LBIC [10] and CAFE [11] chip designs initiated for the Superconducting SuperCollider and then continued for the LHC utilized more compact bipolar transistor processes that allowed circuitry on small pitches. Both the LBIC and CAFE chips utilized a binary readout that only registered the presence of a hit, which reduces dynamic range requirements in the front-end and simplifies the readout stream, both reducing power dissipation.…”

Section: Electronicsmentioning

confidence: 99%

Front-end electronics and trigger systems—Status and challenges

Spieler

2007

Nuclear Instruments and Methods in Physics Research Section A:

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The past quarter century has brought about a revolution in front-end electronics for largescale detector systems. Custom integrated circuits specifically tailored to the requirements of large detector systems have provided unprecedented performance and enabled systems that once were deemed impossible. The evolution of integrated circuit readouts in strip detectors is summarized, the present status described, and challenges posed by the sLHC and ILC are discussed. Performance requirements increase, but key considerations remain as in the past: power dissipation, material, and services. Smaller CMOS feature sizes will not provide the required electronic noise at lower power, but will improve digital power efficiency. Significant improvements appear to be practical in more efficient power distribution. Enhanced digital electronics have provided powerful trigger processors that greatly improve the trigger efficiency. In data readout systems they also improve data throughput, while reducing power requirements. Concurrently with new developments in high energy physics, detector systems for cosmology and astrophysics have made great strides. As an example, a large-scale readout for superconducting bolometer arrays is described.

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“…This single p-type channel of ganged 3-D sensors was bonded to the input of a charge sensitive LBIC [11] bipolar amplifier/comparator chip with a fast 20 ns shaping stage. A threshold was set on the LBIC comparator such that, for any signal above (below) 1 fC, a "1"(0) was passed to the output.…”

Section: Measurements With Beta Raysmentioning

confidence: 99%

Observation of beta and X rays with 3-D-architecture silicon microstrip sensors

Kenney

Parker

Krieger

et al. 2001

IEEE Trans. Nucl. Sci.

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The first silicon radiation sensors based on the three-dimensional (3-D) architecture have been successfully fabricated. X-ray spectra from Iron-55 and Americium-241 have been recorded by reading out a 3-D architecture detector via wire bonds to a low-noise, charge-sensitive preamplifier. Using a beta source, coincidences between a 3-D sensor and a plastic scintillator were observed. This is the first observation of ionizing radiation using a silicon sensor based on the 3-D architecture. Details of the apparatus and measurements are described.

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A fast shaping low power amplifier-comparator integrated circuit for silicon strip detectors

Cited by 39 publications

References 2 publications

The silicon microstrip sensors of the ATLAS semiconductor tracker

The silicon microstrip sensors of the ATLAS semiconductor tracker

Front-end electronics and trigger systems—Status and challenges

Observation of beta and X rays with 3-D-architecture silicon microstrip sensors

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