A Fast Loss and Temperature Simulation Method for Power Converters, Part II: 3-D Thermal Model of Power Module

Swan, Ian R.; Bryant, A.T.; Mawby, P.A.; Ueta, Takashi; Nishijima, Takashi; Hamada, Keisuke

doi:10.1109/tpel.2011.2148730

Cited by 79 publications

(35 citation statements)

References 16 publications

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“…Some other methods for junction temperature estimation have been reported.The temperature field distribution of the chip is calculated by the finite element modeling method [79]; in [80], the transient junction temperature is calculated by Fourier series; literature [81] uses finite difference method to solve the 3-D heat distribution of devices etc. The above three methods are only suitable for simulations and are not suitable for the online calculation.…”

Section: A Junction Temperature Evaluationmentioning

confidence: 99%

Review of Power Semiconductor Device Reliability for Power Converters

et al. 2017

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Section: A Junction Temperature Evaluationmentioning

confidence: 99%

Review of Power Semiconductor Device Reliability for Power Converters

et al. 2017

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“…There has been a wealth of work in the thermal models for electro-thermal analysis of power modules [3][4][5][6][7][8][9][10][11][12][13][14][15]. Finite element method (FEM) and finite difference method (FDM) were commonly employed for the detailed three-dimensional (3D) modeling and accurate simulations of the power packages and/or modules.…”

Section: Introductionmentioning

confidence: 99%

“…They were further used in the model order reduction approach to generate compact thermal models by mathematical manipulation of linear matrix [11][12][13], or by a generalized minimized residual algorithm [10]. Fourier series based thermal models were also used for 3D transient thermal simulation of power modules, with the assumptions of perfect cuboid for each layer in the packaged structures and temperature independent material properties [7][8][9]. All these mentioned thermal models were developed to solve the 3D heat diffusion equation subjected to the boundary conditions of either fixed temperatures [13][14][15] or heat exchanges with the ambient/coolants [7][8][9][10][11][12].…”

Section: Introductionmentioning

confidence: 99%

“…Fourier series based thermal models were also used for 3D transient thermal simulation of power modules, with the assumptions of perfect cuboid for each layer in the packaged structures and temperature independent material properties [7][8][9]. All these mentioned thermal models were developed to solve the 3D heat diffusion equation subjected to the boundary conditions of either fixed temperatures [13][14][15] or heat exchanges with the ambient/coolants [7][8][9][10][11][12]. However, the power modules are rarely encountered with a fixed temperature boundary condition in realistic applications.…”

Section: Introductionmentioning

confidence: 99%

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A Physical RC Network Model for Electrothermal Analysis of a Multichip SiC Power Module

Castellazzi

Eleffendi

et al. 2018

IEEE Trans. Power Electron.

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AbstractThis paper is concerned with the thermal models which can physically reflect the heat-flow paths in a lightweight three-phase half bridge, two-level SiC power module with 6 MOSFETs and can be used for coupled electro-thermal simulation. The finite element (FE) model was first evaluated and calibrated to provide the raw data for establishing the physical RC network model. It was experimentally verified that the cooling condition of the module mounted on a water cooler can be satisfactorily described by assuming the water cooler as a heat exchange boundary in the FE model. The compact RC network consisting of 115 R and C parameters to predict the transient junction temperatures of the 6 MOSFETS was constructed, where cross-heating effects between the MOSFETs are represented with lateral thermal resistors. A three-step curve fitting method was especially developed to overcome the challenge for extracting the R and C values of the RC network from the selected FE simulation results. The established compact RC network model can physically be correlated with the structure and heat-flow paths in the power module, and was evaluated using the FE simulation results from the power module under realistic switching conditions. It was also integrated into the LTspice model to perform the coupled electrothermal simulation to predict the power losses and junction temperatures of the 6 MOSFETs under switching frequencies from 5 kHz to 100 kHz which demonstrate the good electrothermal performance of the designed power module.Index TermsMOSFETs, SiC power module, finite element methods, RC network, curve fitting, three-phase inverters.

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“…The last method is the Fourier series method using the Fourier series expansion to solve the heat diffusion equation. However, this is based on package system materials and physical dimensions [16], [17].…”

Section: Introductionmentioning

confidence: 99%

Thermal Model for Power Converters Based on Thermal Impedance

Xu¹,

Chen²,

Lv³

et al. 2013

Journal of Power Electronics

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In this paper, the superposition principle of a heat sink temperature rise is verified based on the mathematical model of a plate-fin heat sink with two mounted heat sources. According to this, the distributed coupling thermal impedance matrix for a heat sink with multiple devices is present, and the equations for calculating the device transient junction temperatures are given. Then methods to extract the heat sink thermal impedance matrix and to measure the Epoxy Molding Compound (EMC) surface temperature of the power Metal Oxide Semiconductor Field Effect Transistor (MOSFET) instead of the junction temperature or device case temperature are proposed. The new thermal impedance model for the power converters in Switched Reluctance Motor (SRM) drivers is implemented in MATLAB/Simulink. The obtained simulation results are validated with experimental results. Compared with the Finite Element Method (FEM) thermal model and the traditional thermal impedance model, the proposed thermal model can provide a high simulation speed with a high accuracy. Finally, the temperature rise distributions of a power converter with two control strategies, the maximum junction temperature rise, the transient temperature rise characteristics, and the thermal coupling effect are discussed.

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A Fast Loss and Temperature Simulation Method for Power Converters, Part II: 3-D Thermal Model of Power Module

Cited by 79 publications

References 16 publications

Review of Power Semiconductor Device Reliability for Power Converters

Review of Power Semiconductor Device Reliability for Power Converters

A Physical RC Network Model for Electrothermal Analysis of a Multichip SiC Power Module

Thermal Model for Power Converters Based on Thermal Impedance

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