2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)
DOI: 10.1109/ectc.2004.1319342
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A fast full-wave modeling methodology for stripline structures with vertical interconnects in multi-layer dielectrics

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“…This kind of information can be easily acquired from the solution of (14). The procedure is analytically described in [6] and [15].…”
Section: Numerical Analysismentioning
confidence: 99%
“…This kind of information can be easily acquired from the solution of (14). The procedure is analytically described in [6] and [15].…”
Section: Numerical Analysismentioning
confidence: 99%