A fast full-field 3D measurement system for BGA coplanarity inspection

Yen, Hsu-Nan; Tsai, Du‐Ming

doi:10.1007/s00170-003-1778-8

Cited by 10 publications

(4 citation statements)

References 12 publications

(9 reference statements)

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“…In particular, the light-section method can acquire high accuracy 3D information with a relatively simple measurement method by the use of a high directive slit laser. Therefore, it is effective to inspect the shapes of precise parts such as electronic boards and press-processed parts that require spatial precision of the order of 10 µm for a satisfactory refinement of the parts in recent years [3], [4]. However, because only a 3D section profile for a slit line is figured out per image, in many cases, the 3D measurement points are insufficient if a general-purpose image sensor that follows the video signal is used.…”

Section: Conventional Workmentioning

confidence: 99%

A High-Speed 3D Shape Measurement System Using a Multi-Sided Mirror

Yamamoto

Fujii

Ishii

2007

2007 IEEE International Conference on Automation Science and Engineering

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In this paper, the authors propose a new concept for high spatial resolution 3D shape measurement based on the light-section method by setting a multi-sided mirror between an image sensor and measured object. The authors developed a prototype system for 3D measurement based on a high-speed vision hardware, which can process a 1024×1024 pixel image at 1000 fps, and evaluated its effectiveness by showing the experimental results for a printed circuit board.

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Section: Conventional Workmentioning

confidence: 99%

A High-Speed 3D Shape Measurement System Using a Multi-Sided Mirror

Yamamoto

Fujii

Ishii

2007

2007 IEEE International Conference on Automation Science and Engineering

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“…One way to solve this problem is to segment the recon-structed solder paste from the background plane by estimating the offset value between the reference plane and PCB. The offset compensated object phase is given by Offset (21) where a solder paste mask is the projection of the 3-D solder paste profile onto the -plane. The solder paste mask is obtained by thresholding the top view of the solder paste block such that it is imaged from a well-illuminated scene without projecting fringe pattern.…”

Section: G Offset Estimationmentioning

confidence: 99%

3-D Measurement of Solder Paste Using Two-Step Phase Shift Profilometry

Hui¹,

Pang²

2008

IEEE Trans. Electron. Packag. Manufact.

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A two-step phase shift profilometry method (2-step PSP) with prefiltering and postfiltering stages is proposed to reconstruct the 3-D profile of solder paste. Two sinusoidal patterns which are-out-of-phase are used in the 3-D reconstruction. The new method uses only two fringe patterns rather than four as the fourstep phase shift profilometry (4-step PSP). In Fourier transform profilometry (FTP), a bandpass filter is required to extract the fundamental spectrum from the background and higher order harmonics due to camera noise and imperfectness of the pattern projector. By using two-out-of-phase sinusoidal fringe patterns, the background term can be eliminated directly by taking the average of the two fringe patterns. The fringe pattern which is close to its ideal form can also be recovered from the averaging process. Prefiltering is utilized in filtering raw images to remove noise causing higher order harmonics. Hilbert transform is then used to obtain the in-quadrate component of the processed fringe pattern. Postfiltering is applied for reconstructing an appropriate 3-D profile.

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“…Although the system structure was compact, the camera can only capture a line at one time. Yen and Tsai (2004) proposed a 3D measurement system for coplanarity inspection of BGA solder balls. This system used an incoherent light source and software-controlled LCD grating to project the fine sinusoidal fringes on the BGA solder balls.…”

Section: Introductionmentioning

confidence: 99%

Online coplanarity measurement of IC leads based on single camera vision system

Zhong

Zhang

Chen

2016

Transactions of the Institute of Measurement and Control

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To improve the measurement accuracy and speed of online coplanarity measurement of integrated circuit (IC) leads, a new single camera vision system for small outline packaging IC leads was developed. Firstly, a novel imaging optical structure with multiple reflection mirrors and a total reflection rectangular prism was devised. With this structure, the two side views of IC leads are captured at the same time in a small field of view. To guarantee a good assembly quality, the relationship between the assembling deviation of optical components and measurement error is investigated. Secondly, a fast algorithm for the coplanarity measurement of the IC leads is proposed. This algorithm mainly consists of three parts: the IC lead tips searching, the local sub-pixel positioning and the local image correction. Finally, a high precision measurement instrument is used to verify the accuracy of the proposed approach. The experimental results show that the proposed approach is effective in measuring the coplanarity of IC leads in real-time and the measuring error of the standoff is less than 4 mm. Furthermore, the proposed method can gain higher measuring speed and accuracy than existing methods.

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A fast full-field 3D measurement system for BGA coplanarity inspection

Cited by 10 publications

References 12 publications

A High-Speed 3D Shape Measurement System Using a Multi-Sided Mirror

A High-Speed 3D Shape Measurement System Using a Multi-Sided Mirror

3-D Measurement of Solder Paste Using Two-Step Phase Shift Profilometry

Online coplanarity measurement of IC leads based on single camera vision system

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