A partition-recomposition methodology based on internal port concept associated to auxiliary sources, is proposed for electromagnetic (EM) analysis of SiP (SystemIn-Package) Off-chip and On-Chip passive circuitry towards optimized passive and active frequency and time domain cosimulation. Attributes of internal ports and associated deembedding procedures for local ground references are discussed. Application of the proposed methodology to offchip SiP multi-conductors and functional components is presented. A broadband extraction methodology is applied to derive, from EM simulation results or measurement data of passive structures, Spice-compatible models for transient/SSN (Simultaneous Switching Noise) analysis.