A facile way via integrating sol–gel and Grignard reaction to prepare siloxane/carbosilane hybridized benzocyclobutene resins with hyperbranched structure, low dielectric constant, and high thermal stability

Abstract

The hybridization of siloxane‐ and carbosilane‐based structures in molecular scale could combine their advantages of high thermal resistance and low dielectric constant. However, the hybridization still remained a big challenge in lacking convenient synthesis method. Herein, in this work, we developed a new method via simultaneous Grignard and sol–gel reactions of (chrolomethyl)trimethoxysilane to directly generate siloxane/carbosilane hybridized oligomers with hyperbranched structure. The oligomers were subsequently functionalized by benzocyclobutene and cured to produce crosslinked resins. As‐resulted resins have low dielectric constant (~2.60) as compared with silica and higher thermal stability compared with polycarbosilane. The integrated high performance and facile preparation for these resins make them potentially used as low dielectric materials in integrating circuits insulating and wave transmitting.

Low dielectric resins derived from hyperbranched carbosilane oligmers functionalized by benzocyclobutene groups

“…Figure 4 shows the XPS survey of HCBOs and BCBPCS [ 19 ] after curing. It can be seen ( Figure 4 and Table 1 ) that the C content of cured HCBOs is the highest as compared with Si and O elements.…”

“…However, they are generally used as fillers [ 18 ], because the hyperbranched polymers exhibit poor film-forming property. In our previous work, the BCB groups were functionalized on hyperbranched polymers to realize the cross-linking and to improve the performance of polymers [ 19 ]. The hyperbranched polymers (BCBPCS) were prepared from the (Chrolomethyl)trimethoxysilane by Grignard reaction.…”

“…In this way, more Si-C bonds rather than Si-O bonds could be formed in HCBOs. Subsequently, BCB was functionalized on HCBOs [ 19 , 20 ]. Our experiments indicated that HCBOs were curable and HCBRs can be shaped.…”

Benzocyclobutene‐containing Carbosilane Monomers as a Route to Low‐κ Dielectric and Low Dielectric Loss Materials

“…There are numerous studies on BCB‐containing polycarbosilanes with BCB‐side chains [13–20] . More recently, increasing attention has been paid to 3,6‐disubstituted BCB monomers as building units for the main polymer chain.…”

“…[10,11,12] There are numerous studies on BCB-containing polycarbosilanes with BCB-side chains. [13][14][15][16][17][18][19][20] More recently, increasing attention has been paid to 3,6-disubstituted BCB monomers as building units for the main polymer chain. The BCB matrix does not contain active reaction points, so it is difficult to react further with other groups.…”